2025 China (Shenzhen) International Semiconductor Exhibition

Date: November 14-16, 2025

Location: Shenzhen International Convention and Exhibition Center (Bao'an New Building)

Development prospects:

The importance of the semiconductor industry is self-evident, as it serves as the foundation for various high-tech upgrades and permeates into various cutting-edge technological fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching up to 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries including semiconductors were included as key industries in its "Made in China 2025" plan for strong support. The National Outline for Promoting the Development of Integrated Circuit Industry stipulates that by 2030, the main links of the integrated circuit industry chain should reach the international advanced level, and a group of enterprises should enter the international first tier.

In addition, the government also invests heavily in supporting the development of the semiconductor industry. Shouldering the heavy responsibility of supporting China's domestic chip industry, the first phase of the National Integrated Circuit Industry Investment Fund, operated by the National Integrated Circuit Industry Investment Fund Co., Ltd., has a registered capital of 98.72 billion yuan and a total investment scale of 138.7 billion yuan. In investment projects, chip manufacturing accounts for 67%, chip design for 17%, packaging and testing for 10%, and equipment and materials for 6%. The registered capital of the second phase of the large fund has reached 204.15 billion yuan. In terms of investment, in addition to continuing to support the manufacturing process, it is expected to focus on the high-end equipment and new materials fields.

In the past few decades, the development of first and second generation semiconductors has enabled large enterprises in Europe, America, Japan, and South Korea. The efforts of the Chinese government and industry are expected to enhance China's position and voice in the latest generation semiconductor field. The huge demand and limited supply capacity have created great space for the development of the semiconductor industry in China. Despite the unpredictable external environment, the semiconductor industry still has long-term development potential, and this trend will continue to persist in the coming years.

In order to better promote the development of the semiconductor industry and with strong support from national regulatory authorities, the 2025 China (Shenzhen) International Semiconductor Exhibition will be held from June 25th to 27th, 2025 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). This conference will adhere to the exhibition purpose of "highlighting brands, exploring innovation, and focusing on practical results". With unique creativity, scientific and reasonable integration and communication, and excellent services, it will provide a "high-level, high-grade, and high-quality" exhibition and communication stage for exhibitors with a new concept, and create the largest, most valuable, and authoritative top-level event in the semiconductor industry. We look forward to your participation in this exhibition.

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;

3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

7. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, etc;

• Telephone:18916180944
• Contact:Li Yong
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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