In recent years, China's semiconductor industry has grown rapidly and has become a globally active semiconductor market for trade. In addition, with the strong support of the Chinese government for the semiconductor industry, the development of the Chinese semiconductor industry is accelerating. During the 14th Five Year Plan period, China's semiconductor industry will have more comprehensive development and accelerate breakthroughs and applications of key core technologies in high-end chip design and other fields. The importance of the semiconductor industry is self-evident, as it serves as the foundation for various high-tech upgrades and permeates into various cutting-edge technological fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching up to 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries including semiconductors were included as key industries in its "Made in China 2025" plan for strong support. The National Outline for Promoting the Development of Integrated Circuit Industry stipulates that by 2030, the main links of the integrated circuit industry chain should reach the international advanced level, and a group of enterprises should enter the international first tier.

◆Semiconductor, integrated circuit design, manufacturing, packaging:

Integrated circuit design and chips, chip design tools, software and testing, wafer manufacturing, SIP advanced packaging, power device packaging and testing, MEMS packaging and testing, advanced packaging (Chiplet) technology, silicon wafers and IC packaging carriers, packaging substrates and application manufacturing and packaging testing, packaging substrate semiconductor materials and equipment and components, etc;

◆Equipment Manufacturing Zone:

Thinning machine, single crystal furnace, oxidation furnace, grinding, polishing, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, scribing, CVD/PVD/ALD, PECVD equipment MOCVD、 Glue coating, developing machine, solidification machine, cutting machine, cleaning equipment, mounting machine, burning, optical vacuum coating, imaging and testing measurement (microscope/spectrometer/interferometer/optical measurement and testing instrument/optical design software/optical platform and displacement table, etc.), optical instruments, lens and camera (lens/lens), laser equipment, bonding machine, testing machine, sorting machine, vacuum fluid, detection equipment, refrigeration equipment, oxidation equipment, oxidation equipment, clean room equipment;

◆Semiconductor Materials Zone:

Third generation semiconductor materials, silicon wafers and silicon-based materials, optical masks, high-purity gases, electronic specialty gases, wet electron chemistry, photoresist and its supporting reagents, CMP polishing materials, target materials, optical fibers, packaging materials, nanomaterials, chip bonding materials, pipeline valves, crystals, quartz, sapphire, graphene, etc;

◆Automotive Electronics:

Vehicle grade semiconductor control/AI chips, power semiconductors (IGBT and MOSFET), vehicle grade SiC modules, power management chips, automotive electronic micro assembly and power devices, advanced packaging technology for vehicle grade, intelligent networking, intelligent driving intelligent cockpit chips CPU and storage chips MCU, GPU image processing, vision processing chips, vision, sensing technology, radar technology, optical systems, intelligent decision-making technology, high-precision positioning and mapping systems, design and development, and testing solutions, etc;

◆Electronic components:

Passive components, sensors, storage devices, connectors, relays, cables, wiring harnesses, plug-in devices, crystal oscillators, resistors, instruments, display devices, secondary and tertiary transistor filtering components, switches and component materials and equipment, ceramic magnetic materials, printed circuit substrates, etc;

◆Test measurement:

Electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

◆New Display and Intelligent Terminal:

Display and applications, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc;

◆Smart Power Zone:

Microwave RF, semiconductor LED, power management chip, plasma power supply, module power supply, laser power supply, AC, DC power supply, communication power supply, special power supply, power manufacturing equipment and auxiliary materials, power related software, photovoltaic/wind power/energy storage power supply design, military industry, power converter magnetic technology, etc;

• Company:Ancheng Exhibition (Shanghai) Co., Ltd
• Telephone:13816579061
• Contact:Tian Meng
• Mobile:13816579061
• E-mail:2595752551@qq.com
• Address:Shenzhen International Convention and Exhibition Center (Bao'an New Building)

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