2026 Shenzhen International Semiconductor Exhibition: Creating "Chip" Leading, Intelligent Manufacturing for the Future

Exhibition time: April 7-8, 2026

Exhibition time: April 9-11, 2026 (9:00-17:00)

Demolition time: April 11, 2026 (17:00-21:00)

Location: Shenzhen Convention and Exhibition Center

Contact: Director Zhang Han

From April 9th to 11th, 2026, the Shenzhen Convention and Exhibition Center (Futian) will host a grand gathering of the semiconductor industry - the 2026 Shenzhen International Semiconductor Exhibition. The exhibition, with the themes of "Innovation driven Collaborative Development" and "Creating 'Chip' Leading, Intelligent Manufacturing for the Future", attracted more than 1200 exhibitors from around the world. The exhibition area covers 80000 square meters, with over 100000 exhibits, showcasing the latest achievements of the semiconductor industry chain comprehensively.

The exhibition features a variety of highlights, covering the entire semiconductor industry ecosystem from semiconductor manufacturing equipment and materials to core components, from smart home applications to integrated circuit technology. Industry leaders such as Huawei, Hisense, and MediaTek will showcase the latest products in the field of smart homes in all scenarios, allowing visitors to personally experience the intelligent life transformation brought by semiconductor technology.

In the digital age, semiconductor technology has become the core driving force behind technological progress. With the booming development of emerging industries such as 5G, artificial intelligence, and new energy vehicles, the demand for high-performance semiconductors has surged, which has become an important background for the attention of this exhibition. Exhibitors will showcase their latest high-precision semiconductor manufacturing and testing equipment, which directly determines the performance and cost of chips and affects the competitiveness of global electronic products.

At the same time, multiple professional forums will be held to gather domestic and foreign semiconductor industry experts, scholars, and industry elites to jointly explore key issues such as semiconductor technology development trends, industrial chain and supply chain stability, providing a platform for ideological collision for the innovative development of China's semiconductor industry.

As a witness and promoter of the rapid rise of China's semiconductor equipment industry, the 2026 Shenzhen International Semiconductor Exhibition not only showcases the technological progress of the industry, but also provides an important opportunity for global semiconductor industry cooperation, which will inject new vitality into future technological development.

1. Semiconductor equipment and intelligent equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition system, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, plastic sealing machine, reflow soldering, wave soldering, testing machine, bending equipment, sorting machine, robot automation, machine vision, other materials and electronic specialized equipment, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test box, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

2. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, etc;

3. Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

4. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

5. Integrated circuits: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, mixed signal integrated circuit manufacturing, integrated circuit terminal products, etc;

6. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

• Company:Zhuanzhan Exhibition (Shanghai) Co., Ltd
• Telephone:18538304525
• Contact:Zhang Han
• Mobile:18538304525
• Address:Shenzhen Convention and Exhibition Center

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