2026 Shanghai International Thermal Management Liquid Cooling and Heat Dissipation Technology Industry Expo

Exhibition Date: August 12-14, 2026

Exhibition location: Shanghai New International Expo Center

Theme: Leading the Future with Liquid, Smart Chain Win win

With the rapid development of the global new energy industry, thermal management and liquid cooling technology have become core demands in fields such as new energy vehicles, energy storage, data centers, and AI computing power. According to industry forecasts, the scale of liquid cooling is expected to reach 3.5 billion US dollars by 2028, accounting for nearly one-third of the total expenditure on thermal management, and the market size is expected to significantly expand. With the development of the computing power server industry towards modular and secure systems, liquid cooling technology will also move towards modularization and standardization. Especially in scenarios such as battery thermal management, high computing power heat dissipation, and energy storage temperature control, the penetration rate continues to increase. The popularization of liquid cooling technology has led server manufacturers and ecosystem service providers to actively layout and jointly promote the improvement and development of the liquid cooling ecosystem.

In the context of the development of new quality productivity, the core demands of consumer electronics, power electronics, artificial intelligence, 5G communication, data centers, Internet of Things, power batteries, new energy vehicles, energy storage, and new energy fields have jointly promoted the development of efficient and innovative technological solutions for thermal management. These fields not only require terminal devices to have higher efficiency, reliability, and safety, but also emphasize their durability and sustained stability, all of which rely on advanced heat dissipation systems as support.

Therefore, the 2026 Shanghai International Thermal Management Liquid Cooling Technology Industry Expo will be grandly held from August 12-14, 2026 at the Shanghai New International Expo Center. This exhibition focuses on the theme of "Leading the Future with Intelligent Chain Win Win", showcasing the latest products and technologies in the new energy thermal management liquid cooling industry. It establishes a brand image for enterprises, promotes trade cooperation and market development, leads the rapid development of the industry, and deeply understands the new trends in the future development of the domestic and international liquid cooling industry market. It provides the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants. At that time, we warmly welcome domestic and foreign liquid cooling industry enterprises and related industry professionals to visit and exchange ideas!

Host and Strategic Partner:

China Electrotechnical Society Guangdong Semiconductor Industry Association

Shanghai Society of Automotive Engineering and Beijing Internet of Things Intelligent Technology Application Association

Jiangsu Society of Automotive Engineering Wuhan New Energy Vehicle Industry Association

Anhui Automobile Industry Association Yancheng Automotive Engineering Society

Guangdong Automobile Industry Association Sichuan Automobile Engineering Society

Guangdong New Energy Vehicle Industry Association Yingfo Conference and Exhibition (Shanghai) Co., Ltd

Guangdong Society of Automotive Engineering Guangdong Greater Bay Area New Energy Vehicle Industry Technology Innovation Alliance

EVH100O Electric Vehicle Thousand People Meeting Shanghai Charging and Swapping Facilities Public Data Collection and Monitoring Municipal Platform

Tsinghua University Suzhou Automotive Research Institute Shanghai Automotive Parts Industry Association

Shanghai Transportation Electronics Industry Association and Chongqing Automobile Commerce Association

Shanghai Adhesive Technology Association Global Automotive Technology Network

Shanghai Lianlian Charging CEMS Alliance

Organizer: Yingfo Conference Exhibition (Shanghai) Co., Ltd

Jiangsu Yingfo Conference and Exhibition Co., Ltd

Baike Exhibition (Shanghai) Co., Ltd

Concurrent Events

The 11th Shanghai International Automotive Innovation Technology Week in 2026

The 16th Shanghai International New Energy Vehicle Technology and Ecological Chain Exhibition in 2026

2026 Shanghai International Charging, Swapping, and Light Storage Charging Technology Exhibition

Exhibition value

1. Seize the market opportunity: covering the billion dollar liquid cooling and heat dissipation demand markets such as new energy vehicles, energy storage, and data centers;

Reach global buyers and expand opportunities for cooperation in emerging fields both domestically and internationally.

2. Resource integration of the whole industry chain: we mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation/aerospace, new energy vehicles, charging piles, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate. Directly connect with material suppliers, core component manufacturers, and end application enterprises;

3. Technological Trend Outlook: Master the latest development direction of liquid cooling technology, from material innovation to system integration;

Insight into the application opportunities of cutting-edge scenarios such as energy storage thermal management and low altitude economy.

4. Brand influence enhancement: Enhance industry visibility through summit forum speeches, media interviews, and white paper collaborations;

Establish a technological leadership position among professional audiences and decision-makers.

Supporting activity planning

1. Industry Summit Forum: Main Forum: Global Trends and Policy Interpretation of New Energy Thermal Management Technology.

Sub forum: Innovation and Industrialization of Power Battery Liquid Cooling Technology; Development of data center and AI computing power cooling technology;

Collaborative solution for energy storage safety and thermal management.

2. Technical Exchange and Release: Enterprise Technology Session: Theme Sharing on Liquid Cooling System Design, Material Innovation, Testing Technology, etc;

New Product Launch Event: Global debut of enterprise new products and display of technological achievements.

3. Precise supply-demand docking: Procurement demand release from host manufacturers, energy storage integrators, and data center operators;

One on one negotiation meeting between suppliers and end users.

4. Industry university research integration activities: patent technology roadshows for universities and research institutions; Release and interpretation of industrial technology white papers.

Display scope:

New energy thermal vehicle management related technical products: liquid cooling technology, air cooling technology, electric compressor, PTC heater, constant temperature water tank, heat pump, coolant, refrigerant, battery cooling plate, cooler, electronic expansion valve, radiator, heat exchanger, evaporator, condenser, electronic fan, electronic water pump, antifreeze, sealant, structural adhesive, thermal conductive adhesive, potting adhesive, foam adhesive, phase change material, etc

New energy vehicle thermal management system: motor electronic control, powertrain thermal management system, air conditioning thermal management system, power battery, fuel cell thermal management system, cooling system, water-cooled plate, evaporator, condenser, liquid cooled plate, aluminum heat transfer material, thermal simulation, electronic water pump/water valve, insulation/thermal conductivity material, high and low temperature equipment/constant temperature equipment, simulation software, filters, fans, heat pumps, compressors, pipelines and other product accessory production equipment.

Core components of liquid cooling system: cold plate liquid cooling products (microchannel cold plate, modular cold plate, lightweight cold plate); Immersion liquid cooled cabin (single-phase/two-phase immersion system, cooling medium); Liquid cooled pipelines and connectors (pipelines, sealed joints).

Liquid cooling technology solutions: cold plate, immersion, and spray liquid cooling technologies; Intelligent temperature control technology, simulation and design.

Thermal/heat dissipation materials: thermal interface materials (thermal conductive adhesive, phase change materials); Ceramic substrate, carbon material, soaking plate, aerogel, vacuum insulation plate, composite insulation material.

Energy storage thermal management temperature control system: liquid/air cooling temperature control scheme, energy storage battery thermal management scheme, heat exchanger, fire and safety system.

Thermal runaway monitoring: temperature sensor, gas sensor, battery management system.

Thermal storage management: phase change materials, thermal storage and exchange devices, phase change thermal storage system solutions.

Thermal conductive and heat dissipating materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal based composite materials

Thermal conductive polymers: Thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal conductive insulating plastics, thermal conductive rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductive film, diamond materials, etc

Phase change materials (thermal storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt hydrates, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal conduction and heat dissipation components: heat pipes/heat sharing plates, copper-clad laminates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT), etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, metal stamping parts, chassis, cooling pads, finned tubes, heat pipes, heat plates, cooling, touch panels, fan grille, fan, motor, motor, fan automatic assembly machine, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, heat pipe, plug-in heat sink, plug-in heat sink, chassis integrated heat sink, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, rib heat sink, frequency conversion heat sink, heat pipe heat sink, forked heat sink, liquid cooling heat sink, combination heat sink, heat sink for solid-state relays, high-power transistor heat sink and related accessories, etc;

Data center liquid cooling: cooling scheme for cold plate/submerged servers, liquid cooling pipeline system. Aluminum, copper, ammonia testing, brazing, insulation plastic, processing equipment and other essential components: quick connectors, liquid cooling pipelines, water separators, expansion valves, throttle valves, solenoid valves, pumps, compressors, evaporators, heat exchangers, chassis, cooling distribution units, filtration and purification devices, cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, spray liquid cooling technology, two-phase flow (pumping) cooling technology, data center liquid cooling system thermal simulation, immersion liquid cooling material compatibility, quick connector technology, electronic fluorine liquid, electronic coolant, refrigerants, liquid cooling heat dissipation modules, liquid cooling system design, liquid cooling materials, liquid cooling components, leakage detection technology, intelligent fluid distribution technology. Intelligent temperature monitoring technology;

Applications of data centers: modular data centers, data cloud boxes, data center solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for data centers, UPS uninterruptible power supplies, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

Low altitude economy and emerging fields: aircraft thermal management, humanoid robot joint heat dissipation.

Cooling medium: deionized water, ethylene glycol mixture, fluorinated solution; Silicone oil, water-based coolant.

Testing and precision machining equipment: CNC machining centers, vacuum brazing production lines, friction stir welding equipment, dispensing machines, coating/laminating equipment, vacuum injection machines, helium leak detection equipment, ultrasonic flaw detectors, fluid pressure testing systems. Analytical instruments, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity measurement instrument, material strength testing machine, thermal property measurement equipment

Thermal design: thermal simulation/thermal design software, etc; Thermal management solutions: air cooling technology, liquid cooling technology, 3D printing, etc; Thermal analysis: standards, testing, certification, external testing service platforms (universities/research institutes), etc.

Booth fees: Please call to inquire.

Standard booth: (3M x 3M) booth (including three side panels, fascia board, one table and two chairs, 220V power sockets, cleaning fees, etc.).

Open space: does not include any supporting facilities, and can be rented separately if needed. New technology launch event, new product promotion event, and specialized seminar

If enterprises need to arrange such activities, please contact the organizing committee of the conference in a timely manner to arrange a better time slot.

Please communicate and contact us in a timely manner to obtain the latest exhibition information

Contact: Ren Wei 18501659956

Fax: 021-51062285

• Telephone:18501659956
• Contact:Ren Wei
• Mobile:18501659956
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

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