2026 Shanghai International Data Center Liquid Cooling and Cooling Technology Ecological Chain Exhibition

Simultaneously holding the AI Computing Power Server Liquid Cooling Technology Industry Development Forum

Date: August 12-14, 2026

Location; Shanghai New International Expo Center

Date: October 22-24, 2026

Location; Guangzhou Airport Expo Center

Leading the Future with Intelligent Chain for Win win

With the gradual outbreak of technology application markets such as 5G, artificial intelligence, and big data, the development of the data center industry has been very rapid. As a new engine of economic growth, data centers also play an important role in achieving China's "dual carbon" goals. Building high-efficiency data centers and promoting the transformation of Chinese data centers towards greener, low-energy, and sustainable directions is the current direction of joint efforts. Thermal management and liquid cooling technology have become core requirements in fields such as new energy vehicles, energy storage, data centers, and AI computing power. According to industry forecasts, the scale of liquid cooling is expected to reach 3.5 billion US dollars by 2028, accounting for nearly one-third of the total expenditure on thermal management, and the market size is expected to significantly expand. With the development of the computing power server industry towards modular and secure systems, liquid cooling technology will also move towards modularization and standardization. Especially in scenarios such as battery thermal management, high computing power heat dissipation, and energy storage temperature control, the penetration rate continues to increase. The popularization of liquid cooling technology has led server manufacturers and ecosystem service providers to actively layout and jointly promote the improvement and development of the liquid cooling ecosystem. In the context of the development of new quality productivity, the core demands of consumer electronics, power electronics, artificial intelligence, 5G communication, data centers, Internet of Things, power batteries, new energy vehicles, energy storage, and new energy fields have jointly promoted the development of efficient and innovative technological solutions for thermal management.

Therefore, the 2026 Shanghai International Data Center Liquid Cooling and Cooling Technology Ecological Chain Exhibition will be held on August 12-14, 2026 at the Shanghai New International Expo Center. The theme of this exhibition is "Leading the Future with Intelligent Chain Win Win", which focuses on showcasing the latest products and technologies in the thermal management liquid cooling industry, establishing brand image for enterprises, promoting trade cooperation and market development, leading the rapid development of the industry, and deeply understanding the new trends in the future development of the domestic and international liquid cooling industry market. It provides the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants. At that time, we warmly welcome domestic and foreign liquid cooling industry enterprises and related industry professionals to visit and exchange ideas!

Host and Strategic Partner:

Yingfo Conference Exhibition (Shanghai) Co., Ltd. EVH1000 Electric Vehicle Thousand People Meeting

Beijing Internet of Things Intelligent Technology Application Association, China Electrotechnical Society

Tsinghua University Suzhou Automotive Research Institute Shanghai Automotive Parts Industry Association

Shanghai Automotive Engineering Society and Shanghai Transportation Electronics Industry Association

Chongqing Automobile Commerce Association Jiangsu Automotive Engineering Society

Shanghai Adhesive Technology Association Wuhan New Energy Vehicle Industry Association

Anhui Automobile Industry Association Shanghai Lianlian Charging CEMS Alliance

Yancheng Automotive Engineering Society Guangdong Automobile Industry Association

Sichuan Society of Automotive Engineering Guangdong New Energy Vehicle Industry Association

Global Automotive Technology Network Guangdong Society of Automotive Engineering

Guangdong Semiconductor Industry Association Guangdong Greater Bay Area New Energy Vehicle Industry Technology Innovation Alliance

Shanghai Municipal Platform for Public Data Collection and Monitoring of Charging and Swapping Facilities

Organizer: Jiangsu Yingfo Conference and Exhibition Co., Ltd

Yingfo Conference Exhibition (Shanghai) Co., Ltd

Baike Exhibition (Shanghai) Co., Ltd

Concurrent Events

The 12th Shanghai International Automotive Innovation Technology Week in 2026

The 16th Shanghai International New Energy Vehicle Supply Chain Exhibition in 2026

2026 Shanghai International Charging, Swapping, and Light Storage Charging Technology Exhibition

Exhibition value

1. Seize the market opportunity: covering the billion dollar liquid cooling and heat dissipation demand markets such as new energy vehicles, energy storage, and data centers;

Reach global buyers and expand opportunities for cooperation in emerging fields both domestically and internationally.

2. Resource integration of the whole industry chain: we mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation/aerospace, new energy vehicles, charging piles, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate. Directly connect with material suppliers, core component manufacturers, and end application enterprises;

3. Technological Trend Outlook: Master the latest development direction of liquid cooling technology, from material innovation to system integration;

Insight into the application opportunities of cutting-edge scenarios such as energy storage thermal management and low altitude economy.

4. Brand influence enhancement: Enhance industry visibility through summit forum speeches, media interviews, and white paper collaborations;

Establish a technological leadership position among professional audiences and decision-makers.

Supporting activity planning

1. Industry Summit Forum: Main Forum: Data Center Liquid Cooling and Cooling Ecological Conference Global New Energy Thermal Management Technology Trends and Policy Interpretation.

Sub forum: Innovation and Industrialization of Power Battery Liquid Cooling Technology; Development of data center and AI computing power cooling technology; Collaborative solution for energy storage safety and thermal management.

2. Technical Exchange and Release: Enterprise Technology Session: Theme Sharing on Liquid Cooling System Design, Material Innovation, Testing Technology, etc; New Product Launch Event: Global debut of enterprise new products and display of technological achievements.

3. Precise supply-demand docking: Procurement demand release from host manufacturers, energy storage integrators, and data center operators; One on one negotiation meeting between suppliers and end users.

4. Industry university research integration activities: patent technology roadshows for universities and research institutions; Release and interpretation of industrial technology white papers.

exhibition scope

Data center liquid cooling: cooling scheme for cold plate/submerged servers, liquid cooling pipeline system.

Aluminum, copper, ammonia testing, brazing, insulation plastic, processing equipment and other essential components: quick connectors, liquid cooling pipelines, water separators, expansion valves, throttle valves, solenoid valves, pumps, compressors, evaporators, heat exchangers, chassis, cooling distribution units, filtration and purification devices, cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, spray liquid cooling technology, two-phase flow (pumping) cooling technology, data center liquid cooling system thermal simulation, immersion liquid cooling material compatibility, quick connector technology, electronic fluorine liquid, electronic coolant, refrigerants, liquid cooling heat dissipation modules, liquid cooling system design, liquid cooling materials, liquid cooling components, leakage detection technology, intelligent fluid distribution technology. Intelligent temperature monitoring technology;

Applications of data centers: modular data centers, data cloud boxes, data center solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for data centers, UPS uninterruptible power supplies, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

Energy storage thermal management temperature control system: liquid/air cooling temperature control scheme, energy storage battery thermal management scheme, heat exchanger, fire and safety system.

Thermal runaway monitoring: temperature sensor, gas sensor, battery management system.

Thermal storage management: phase change materials, thermal storage and exchange devices, phase change thermal storage system solutions.

Low altitude economy and emerging fields: aircraft thermal management, humanoid robot joint heat dissipation.

Cooling medium: deionized water, ethylene glycol mixture, fluorinated solution; Silicone oil, water-based coolant.

Testing and precision machining equipment: CNC machining centers, vacuum brazing production lines, friction stir welding equipment, dispensing machines, coating/laminating equipment, vacuum injection machines, helium leak detection equipment, ultrasonic flaw detectors, fluid pressure testing systems. Analytical instruments, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity measurement instrument, material strength testing machine, thermal property measurement equipment

Thermal design: thermal simulation/thermal design software, etc; Thermal management solutions: air cooling technology, liquid cooling technology, 3D printing, etc; Thermal analysis: standards, testing, certification, external testing service platforms (universities/research institutes), etc.

Data Center Infrastructure: Data Center Infrastructure Solutions, Edge Data Center Solutions, Micro Module Data Centers, Air Conditioning, Refrigeration and Fresh Air Systems, Liquid Cooling Technology, Power Supply and Distribution Systems, Integrated Cabling Systems, Data Center Building and Decoration Materials, Large Screen Display Systems, Fire Protection Systems, Security Systems, Computing Infrastructure, Servers/Storage, Network Equipment, Optical Communication/Optical Transmission Al chip/DPU/CPU/GPU, memory chip, edge computing chip, edge computing, liquid cooling data center, supercomputing center/intelligent computing center/edge data center, cloud service, Internet of Things, computing security, software application, intelligent products and technologies, intelligent products, Internet of Things technology, AlI auxiliary operation and maintenance technology, Al energy efficiency management technology, BIM building information model, CFD simulation, control system, intelligent new materials, energy-saving products and technologies, intelligent operation and maintenance, DCIM automatic operation and maintenance software, KVM virtual machine, dynamic environment monitoring, asset management, visual data center management system, patrol robot, ITOM operation and maintenance, design engineering and system Integration, EPC general contractor, planning and planning services, IDC design, engineering, system integration, energy storage and energy-saving technology, cloud computing, IDC service provider, ICT equipment system, network information security, etc

Professional audience purchasing buyers gather:

Server and data center: ByteDance, Tencent, Alibaba Cloud, Inspur, Unisplendor, Huawei, Zhongke Dawning, Xinhua 3, Lenovo, Aerospace 706, ZTE, Wanguo Data, Dataport, Qinhuai Data, Zhongjin Data, Aofei Data, Halon New Network, Green Cloud Map, Yunku, Ningchang Information, Ericsson, Nokia, Samsung, Hyperfusion, Yixintong, Kehua Data, Huakun Zhenyu, Yingyeda, Fiberhome Communication, Zhongke Controllable, Aite Netenergy, Viti Technology, etc;

Smart terminals and chips: Samsung, Xiaomi oppo、vivo、 Asustek, Desai Xiwei, Infineon, Tianma Microelectronics, Sunny Optics, Black Sesame, Horizon, ByteDance, Valeo, Siemens, Faurecia, Huayang Electronics, Hikong Core Innovation, Hikvision, ZTE Microelectronics, Huichuan, United Auto Electronics, Huaqin, etc;

Liquid cooling system units: Yingweike, Gaolan Co., Ltd., Sanhua, Yinlun, Tongfei Co., Ltd., Shuguang Shuchuang, Changzhou Hesite, Shanghai Kegai Cooling, Beishide, Zhengbei Connection, Shanghai Lanke, Nuotong Suzhou Fluid, Pazhuo Pipeline, AVIC Optoelectronics, Staubier, etc;

Liquid cooled plates&radiators: Faurecia, Wuhan Mahler, Guangdong Wenxuan, Maitai Thermal Transmission, DaTu Thermal Control, Xiangbo Thermal Transmission, Xunxin Thermal Transmission, Guizhou Yonghong, Feirongda, Weibo Chi, Guangdong Yingfan, Huachuang Thermal Control, Tongyu Electronics, Sanye Technology, Weiteng Electric, Tianjin Yuxin, Baode Technology, Hengchuang Thermal Management, Nanjing Aikemei, etc;

Energy storage companies: Rongjie Energy, Sunshine Power, BYD, Gudewei, Guriwatt, Kehua Data, Kesida, Xuji Electric, Nanrui Jibao, Qidian Energy, Tebian Electric, Bantelio, Baozhun Power, Fushi New Energy, Long Power, Sanjing Electric, Xilin Electric Gas, Magreen Energy, Shangneng Electric, Shenghong Electric, Kelu Electric, Soying Electric, Xinfengguang, etc

VC temperature equalization board: AVC, Shuobide, Zhongshi Weiye, Lixun Thermal Transmission, Feirongda, Lingyi Zhizao, Delimeng Electronics, Kunshan Yingfan, Shunzhi Technology, Tianmai Thermal Transmission, Shenzhen Weibo Chi, Huachuang Thermal Control, Longhui Technology, Huakong Optoelectronics, Liminda Electronics, Chuyue Thermal Transmission, Zhihui Chuangfu Electronics, Shuanghong Technology, Baode, Zhengkang Thermal Transmission, etc;

Liquid cooled and high thermal conductivity materials: Taijino, Mobil, Huaqing, Heyi, Runke, Hunan Cherui, Dow, DuPont, Eken, Wacker, Arlide, Hongfucheng, Leizton, Feirongda, Aochuan, Sany Electronics, Carbonelement Technology, Fuxin Technology, Sany Thermal Conductivity, Anshao, Gaopin Thermal Conductivity, Liqun Lianfa, Honeywell, Laird, Zhongshi Technology, Boon, etc;

The above rankings are in no particular order

Booth fees: Please call to inquire.

Standard booth: (3M x 3M) booth (including three side panels, fascia board, one table and two chairs, 220V power sockets, cleaning fees, etc.).

Open space: does not include any supporting facilities, and can be rented separately if needed. New technology launch event, new product promotion event, and specialized seminar

If enterprises need to arrange such activities, please contact the organizing committee of the conference in a timely manner to arrange a better time slot.

For more details, please contact us in a timely manner to obtain the latest exhibition information

Contact: Ren Wei 18501659956

Fax: 021-51062285

• Telephone:18501659956
• Contact:Ren Wei
• Mobile:18501659956
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

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