2026 Shenzhen International High Power Materials and Equipment Exhibition

Time: June 10-12, 2026

Address: Shenzhen International Convention and Exhibition Center

organization structure

Organizational unit: Electronic Materials Science Branch of China Electronics Society

Organizer: Shanghai Xuntong Exhibition Co., Ltd

Exhibition Background

The 2026 Shenzhen International High Power Materials and Equipment Exhibition, abbreviated as "CIME EXPO", will be held from June 10-12, 2026 at the Shenzhen International Convention and Exhibition Center. The exhibition focuses on the fields of high-power materials, high-power devices, equipment, and testing instruments, and strives to promote the continuous development of the high-power materials industry through a professional, unique, and international exhibition mode. With its high-quality professional audience, it has become a renowned international exhibition in the high-power materials industry and a reference platform for predicting the development of the high-power materials industry and making decisions for enterprises. The exhibition is a platform for purchasing high-power materials, components, and equipment across the entire industry chain, providing a "one-stop shop" experience for all participants, allowing us to gain practical knowledge, tailor product applications, and even more benefits.

The CIME exhibition mainly covers the latest developments in the fields of semiconductors, thermal management, electronic materials, processing equipment, testing instruments, and more in high-power materials. Bringing new impetus to the development of high-power materials and their application fields, as well as the high-power materials and high-power device industry. Thanks to the continuous exploration and efforts of industry enterprises, high-power material technology can bring new growth opportunities for more manufacturing industries..

The preparation work for the 2026 Shenzhen International High Power Materials and Equipment Exhibition has been fully launched. We sincerely invite professionals from all aspects of the high-power materials industry chain at home and abroad to participate and contribute to the progress of the high-power materials industry. We look forward to meeting you at the CIME EXPO 2026 site!

Exhibition Schedule

Report Exhibition: June 08-09, 2026 Opening Ceremony: June 10, 2026 09:30

Display transaction: June 10-12, 2026 Withdrawal: June 12, 2026 15:00

Industry Summit

The professional and international event, CIME EXPO 2026, will invite nearly 600 well-known enterprises from more than 20 countries and regions including South Korea, Japan, Belgium, France, Italy, Germany, the United States, and Taiwan to participate, with an exhibition area of 20000 square meters.

◎ Technical Lectures - During the CIME EXPO 2026 exhibition, multiple comprehensive technical exchange activities and academic seminars will be held simultaneously, aiming to fully cooperate with exhibitors' diversified promotional strategies and discuss industry hot topics. The cost per session is 28000 yuan for domestic enterprises and 4000 US dollars for foreign enterprises (25 minutes or less will be charged per session).

The five major contents of CIME EXPO 2026 are presented brilliantly!

Brand Display High Level Forum Industry User Negotiation Conference Foreign Procurement Conference New Technology and Product Launch Conference

Establishing an international procurement and trade platform, promoting communication and cooperation among enterprises, and improving exhibition effectiveness

————This will be our goal!

Exhibition scope

1. High power materials: gallium oxide, gallium nitride, aluminum gallium nitride, silicon nitride, diamond, graphene, power semiconductors, aluminum based materials, copper based materials, ceramic materials, negative electrode materials, silicon-based materials, coating materials, ternary materials, graphite materials, polymer materials, thermal interface materials, absorbing materials, conductive materials, heat dissipation materials, nanomaterials, silicon carbide, aluminum oxide, etc;

2. High power devices: power electronic devices, power semiconductor devices, resistive components, capacitive components IGBT、 Diode components, thyristors, transistors, wide bandgap semiconductor devices, modular power devices, other special devices, etc;

3. Equipment and components: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment solidification machine, plasma cleaning agent, cutting machine, mounting machine, bonding machine, wire bonding machine, reflow soldering, wave soldering, testing machine, sorting machine, coupling machine, carrier forming machine, testing equipment, instruments, sensors, packaging molds, testing fixtures, precision slide table, constant temperature and humidity testing machine, stepper motor, valve, probe station, clean room equipment, water treatment and power semiconductor equipment components, etc;

Priority Customer

The exhibition will invite experts and representatives from relevant scientific research institutions at the national, provincial, municipal and provincial levels: electronic equipment, power management, thermal management, motor drive, new energy vehicles, charging piles, chip manufacturing, data center, integrated IGBT, rail transit, 5G/6G base stations, industry, energy Internet, aerospace, national defense and military industry, consumer electronics, automotive electronics, controllers, mobile communications, semiconductors, smart grids, universities, research institutes, consulting institutions and public institutions to visit and negotiate.

Exhibition Tips

1. Please fill out the "Exhibition Application and Contract" form carefully and fax it to the organizing committee with the official seal.

2. After applying for a booth, exhibitors are required to wire transfer the booth fee to the designated account of the conference within 3 working days. After the remittance, please fax the remittance receipt to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not reserve the original booth.

3. The principle of booth sequence allocation is "apply first, pay first, arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the final right to adjust the booths of some exhibitors.

Please communicate and contact us in a timely manner to obtain the latest exhibition information

Contact unit: Shanghai Xuntong Exhibition Co., Ltd

Phone: 021-54155272

Contact: Mr. Cai Xuyang 136 8165 8788

• Telephone:136 8165 8788
• Contact:Mr. Cai Xuyang
• Mobile:136 8165 8788
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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