2026 Semiconductor Exhibition | Shenzhen International Semiconductor Equipment Exhibition

The 14th Shenzhen International Semiconductor Exhibition in 2026

Date: April 9-11, 2026

Location: Shenzhen Convention and Exhibition Center (Futian)

Exhibition Introduction:

With the continuous research and technological breakthroughs in the domestic semiconductor industry, China has become one of the largest consumer countries in the global semiconductor manufacturing industry. In the next few years, China will become the world's largest semiconductor market. This also means that China will play an important role in promoting the development of the global semiconductor industry and become a key development trend in the global semiconductor industry in the coming years. The semiconductor industry will continue to maintain stable growth in the coming years and play an increasingly important role in the global economy.

The 14th Shenzhen International Semiconductor Exhibition 2026 will be held at the Shenzhen Convention and Exhibition Center from April 9-11, 2026. It is an international and professional exhibition platform focused on the semiconductor industry, gathering influential exhibitors in multi chip design and manufacturing, integrated circuits, packaging and testing, materials and equipment, 5G new applications, new displays, etc., to fully showcase the semiconductor industry chain, create a deep technical exchange platform, and fully tap into the new development needs of the industry through industry trend interpretation, policy guidance, and technology sharing, and jointly explore new market opportunities.

Exhibition scope:

1. Semiconductor equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition systems, solidification machines, plasma cleaning equipment, cutting machines, mounting machines, bonding machines, wire bonding machines, plastic packaging machines, reflow soldering, wave soldering, testing machines, bending equipment, sorting machines, robot automation, machine vision, other materials and electronic specialized equipment, coupling machines, carrier forming machines, testing equipment, constant temperature and humidity test chambers, sensors, packaging molds, testing fixtures, precision slide tables, stepper motors, valves, probe stations, clean room equipment, water treatment, etc;

2. IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

3. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

4. Integrated circuit manufacturing: wafer fabs, wafer foundries, analog integrated circuits, digital integrated circuits, hybrid integrated circuit manufacturing, integrated circuit terminal products, etc;

5. Packaging and testing support: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature adhesive tape, laminated substrate, patch adhesive, feeding board, wire flow control, quartz graphite, silicon carbide, etc;

6. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

7. Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

8. Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, switch and component materials and equipment, etc;

Reason for participation:

Professional buyers: VIP buyer invitation | buyer procurement matchmaking meeting, face-to-face negotiation, signing, and zero distance transactions

High end conference: Understanding the latest development trends and technological hotspots in the industry

Comprehensive media promotion: TV stations, radio stations, magazine and newspaper advertisements, outdoor advertising, news release push, online marketing, etc

Database precise promotion: Through email group sending, SMS, and telephone marketing, regularly and accurately push to industry users

High end gathering: Domestic entrepreneurs and high-end figures gather together to develop a circle of friends in the semiconductor industry

Please contact the organizing committee for specific exhibition fees and booth distribution maps

Contact: Mr. Hu

Mobile/WeChat: 13524378665

• Telephone:13524378665
• Contact:Mr. Hu
• Mobile:13524378665
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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