Currently, the global digital transformation is driving the semiconductor integrated circuit industry to become a core driving force. The development of fields such as 5G, artificial intelligence, and new energy vehicles highly relies on semiconductor chips. While the global market continues to grow, it is also accompanied by new opportunities and challenges. As a national strategic industry, the semiconductor industry has received multiple policy supports, and has been listed as a key focus in both the "Made in China 2025 Plan" and the "14th Five Year Plan". Semiconductor integrated circuits are like the "heart" of the digital age, driving innovation and change in various fields. In recent years, the global semiconductor market has continued to grow in size, with emerging technologies constantly emerging, bringing new opportunities and challenges to the development of the industry. The "2026 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition" will be held from May 22-24, 2026 at the Binhu International Convention and Exhibition Center in Hefei. The exhibition will revolve around the theme of "Winning the Chip Era, Creating a Chip Future Together" and provide exhibitors with a global business exchange space.

Exhibition Scope

1. Ic Design/Chip Zone

EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, artificial intelligence chips, power management chips, IoT chips, 5G communication chips and solutions, automotive electronic chips, security control chips, mixed signal communication RF chips, storage chips, LED lighting and display driver chips, etc;

2. Wafer Manufacturing and Packaging Zone:

Wafer manufacturing, SiP advanced packaging OSATs、 EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and testing, and packaging testing EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

3. Integrated Circuit Manufacturing Zone

Wafer manufacturing, wafer foundry, analog integrated circuit, digital integrated circuit, and mixed signal integrated circuit manufacturing;

4. Third Generation Semiconductor Zone

Third generation semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED, laser LD, detector UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave RF devices (HEMT, MMIC), etc.

5. Semiconductor Materials Zone

Silicon wafers, silicon chips, photoresists, wafer tapes, photomasks, electronic gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging materials, slicing, grinding, polishing, thin films, silicon wafers and silicon-based materials, photomask templates, high-purity gases, electronic specialty gases, wet electronic chemicals, photoresists and their supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, fluids, valves, etc; 6. Equipment Manufacturing Zone

Thinning machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD, PECVD equipment, coating and developing machine, detection equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station, clean room equipment, water treatment, etc;

7. Packaging Testing Zone

Packaging and testing equipment, packaging and testing process line enterprises, testing probe stations, testing machines, sorting machines, packaging equipment, packaging substrates, lead frame bonding wires, etc;

8. Electronic Components Zone

Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates for printed circuits, electronic functional process specific materials, electronic adhesive (tape) components, electronic chemical materials and parts, etc;

9. AI+5G Zone

Industrial Internet platform, intelligent robot, smart factory, smart car networking, smart phone, intelligent transportation, aerospace electronics, smart home appliances, UAV, 5G development and application, multi access edge computing, network slicing, virtual technology, medical electronics, etc;

10. Smart Power Zone

Microwave RF, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/wind power/energy storage power supply design, power converter magnetic technology, etc;

11. Comprehensive exhibition area

Government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, etc.

• Company:Beijing Zhongwei International Exhibition Co., Ltd
• Contact:Zhang Pan
• Mobile:18610667226
• E-mail:1120201791@qq.com
• Address:No. 735 Huangkan Village, Jiuduhe Town, Huairou District, Beijing

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