2026 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition

May 22-24, 2026, Hefei Binhu International Convention and Exhibition Center

In an important article published in Qiushi, the General Secretary emphasized the need to focus on key areas such as semiconductors and integrated circuits, accelerate the forging of long boards, fill in short boards, cultivate large enterprises and ecological leading enterprises with international competitiveness, build an independent and controllable industrial ecology, and provide direction for the development of China's semiconductor and integrated circuit industry.

Currently, the global digital transformation is driving the semiconductor integrated circuit industry to become a core driving force. The development of fields such as 5G, artificial intelligence, and new energy vehicles highly relies on semiconductor chips. While the global market continues to grow, it is also accompanied by new opportunities and challenges. As a national strategic industry, the semiconductor industry has received multiple policy supports, and has been listed as a key focus in both the "Made in China 2025 Plan" and the "14th Five Year Plan". Semiconductor integrated circuits are like the "heart" of the digital age, driving innovation and change in various fields. In recent years, the global semiconductor market has continued to grow in size, with emerging technologies constantly emerging, bringing new opportunities and challenges to the development of the industry.

The "2026 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition" will be held from May 22-24, 2026 at the Binhu International Convention and Exhibition Center in Hefei. The exhibition will revolve around the theme of "Winning the Chip Era, Creating a Chip Future Together" and provide exhibitors with a global business exchange space.

Exhibition advantages

The unique advantage of Hefei Semiconductor Exhibition lies in the "industry real-life" experience. Based in a national integrated circuit industry cluster, the exhibition can seamlessly connect the entire industry resources from EDA tools to circular manufacturing in the local area, allowing exhibitors to not only gain insight into cutting-edge trends, but also connect the upstream and downstream of the industry in person, achieving efficient transformation from information acquisition to cooperation implementation.

Choosing the Hefei Semiconductor Exhibition is to seize the entrance to the industrial highland. Not only can it connect domestic and foreign semiconductor core enterprises, but it can also directly face the innovative achievements and demands in key fields such as chip design and high-end manufacturing. Next, Hefei will focus on developing chip design, high-end packaging, and specialty wafer manufacturing, with cooperation with domestic and foreign enterprises as the engine, to achieve synchronous promotion of design, manufacturing, packaging, and testing, accelerate the construction of a national integrated circuit industry cluster, and make every effort to build (China's IC Capital).

development prospects

In the future, the rise of Anhui Semiconductor is unstoppable. The series of projects in the fields of chips and semiconductors are becoming the hardcore driving force for technological innovation and industrial upgrading, consolidating their strategic position in the national industrial chain and injecting surging momentum into high-quality economic development. Currently, major projects covering the entire chain of research and development, production, and application are being fully launched in Anhui Province. The success of these projects will undoubtedly promote technological innovation and development in the semiconductor industry in Anhui, laying an unshakable solid foundation for building a top domestic semiconductor industry chain and ecosystem.

Hefei will focus on the "6+5+X" industrial cluster system, focusing on integrated circuits and new technologies ♀ We will continue to make efforts in fields such as display, artificial intelligence, and aerospace information, further focus on original innovation, fully leverage Hefei's innovation advantages, and make every effort to build the "IC Capital of China", cultivate and strengthen future industries, accelerate the formation of a batch of new quality productive forces, and achieve high-quality economic and social development. While building core industries in Hefei, various regions within the province have formed their own characteristics based on resources and jointly improved the industrial chain. For example, the entire semiconductor industry chain and related applications in Hefei, Bengbu focuses on MEMS product circle production, sensor chips, and military civilian integration, and highlights its characteristics in MEMS applications in industrial, automotive electronics, communication electronics, and consumer electronics fields. Chuzhou and Ma'anshan are deeply engaged in packaging testing and materials, Wuhu compound semiconductors are applied in automobiles and home appliances, Tongling lead frames, packaging testing equipment, Chizhou focuses on power semiconductors, discrete device manufacturing, and packaging testing. The industrial chain covers everything from design, manufacturing to packaging and testing.

1. IC Design/Chip Zone: EDA, IP Design, Embedded Software, Digital Circuit Design, Analog and Mixed Signal Circuit Design, Integrated Circuit Layout Design, Artificial Intelligence Chips, Power Management Chips, IoT Chips, 5G Communication Chips, Automotive Electronic Chips, Security Control Chips, Digital Analog Hybrid Communication RF Chips, Storage Chips, Display Driver Chips, etc;

2. Integrated Circuit Manufacturing Zone: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuit manufacturing;

3. Material Zone: Silicon wafers, silicon chips, monocrystalline silicon, silicon wafers, photoresist, chemical reagents, electronic gases, polishing materials, photoresist materials, metal target materials, compound semiconductor materials, etc;

4. Third Generation Semiconductor Zone: Materials and Application Technologies such as Silicon Carbide (SiC), Gallium Nitride (GaN), Zinc Oxide (ZnO), Diamond, etc;

5. Equipment Zone: Semiconductor wafer equipment, semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, etc;

6. Packaging testing and measurement: packaging and testing entire factory, packaging and testing process factory line enterprise, testing probe station, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

7. Electronic Components Zone: Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process materials, electronic adhesive (tape) components, electronic chemical materials and parts, microwave components, communication equipment, microwave materials, microwave RF testing instruments, specialized software, etc;

8. New displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays, application terminal displays, flexible displays and materials and equipment, etc;

9. Big data and artificial intelligence: big data and artificial intelligence, big data and intelligent manufacturing, big data and smart cities, big data and health care, big data and financial innovation, big data and e-commerce, etc;

• Company:Beijing Zhongwei International Exhibition Co., Ltd
• Contact:Yang Lu
• Mobile:13511078171
• E-mail:316183212@qq.com
• Address:No. 735, Jiuduhe Town, Huairou District, Beijing

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