2026 Automotive Power Semiconductor Exhibition | 2026 Shanghai Automotive Semiconductor Exhibition | 2026 Semiconductor Exhibition

The 16th Shanghai International New Energy Vehicle Power Semiconductor Exhibition in 2026 is hot in August

Exhibition information:

Exhibition time: August 12-14, 2026

Exhibition location: Shanghai New International Expo Center

Exhibition area: 70000+square meters

Exhibiting brands: 800+

Audience Count: Over 80000 professional visitors and 220+professional buyer groups from over 30 countries and regions worldwide

Exhibition Introduction:

At present, a new round of global technological and industrial transformation is flourishing, and technologies related to automobiles, energy, transportation, information and communication are accelerating their integration. Electrification, networking, and intelligence have become the development trends and tendencies of the automotive industry. New energy vehicles are the main direction for the transformation, upgrading, and green development of the global automotive industry, and also a strategic choice for the high-quality development of China's new energy vehicle industry.

In the process of electrification of new energy vehicles, power semiconductor devices are widely used in fields such as electric motor drive, car charging stations, and car chargers. Among them, IGBT is one of the most commonly used power semiconductor devices, which can achieve high voltage and high current switching control. IGBT can be combined with MOSFET to form a non inductive continuously variable transmission, which improves the energy efficiency of automobiles.

The 2026 Shanghai International New Energy Vehicle Power Semiconductor Exhibition is one of the special exhibition areas of the Shanghai International New Energy Vehicle Technology and Ecological Chain Expo, which will be held at the Shanghai New International Expo Center from August 12-14, 2026. To provide a "high standard, high taste, and high quality" international trading platform for new energy vehicle power semiconductors for domestic and foreign exhibitors with a brand new concept. We will showcase the latest products and technologies in the field of power semiconductors for new energy vehicles in China, including basic semiconductor devices for vehicles, silicon-based power devices for vehicles, third-generation semiconductor (SiC/GaN) devices, production equipment, packaging testing, etc. We will actively build this exhibition into a large-scale exchange platform that integrates government, park, and enterprise image display, equipment display and procurement, technical seminars, new product releases, industry docking, financial investment, and trade negotiations.

Simultaneously held:

The 12th Shanghai International Automotive Innovation Technology Week in 2026

The 21st Shanghai International Automotive Interior and Exterior Exhibition in 2026

The 16th Shanghai International Charging Station and Battery Swap Technology Exhibition in 2026

The 16th Shanghai International New Energy Vehicle Technology and Ecological Chain Expo in 2026

Scope of exhibits:

Basic semiconductor devices: bipolar transistors, diodes, thyristors, rectifiers, TVS, ESD protectors, silicon-based power devices for vehicles (MOSFET/IGBT and Schottky diodes), etc;

Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

Packaging and Testing: Testing probe stations, probe cards, testing machines, sorting machines, packaging equipment, packaging substrates, lead frame bonding wires, lead bonding, soldering testing, automated testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrates, patch adhesives, feeding plates, wire flow control, quartz graphite, silicon carbide, etc;

Semiconductor equipment manufacturing: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition systems, solidification machines, plasma cleaning equipment, cutting machines, mounting machines, bonding machines, wire bonding machines, plastic packaging machines, reflow soldering, wave soldering, testing machines, bending equipment, sorting machines, robot automation, machine vision, other materials and electronic specialized equipment, coupling machines, carrier forming machines, testing equipment, constant temperature and humidity test chambers, sensors, packaging molds, testing fixtures, precision slide tables, stepper motors, valves, probe stations, clean room equipment, water treatment, etc;

Other related supporting facilities: design and development, heat dissipation management, reliability testing and certification, information services, etc.

Target audience:

Professional visitors come from new energy vehicle manufacturers, motor drive systems, on-board OBC, on-board DC/DC, charging piles, semiconductor manufacturers and other technical personnel and management personnel engaged in related work to visit and negotiate cooperation. We look forward to meeting you on site.

Exhibition consultation:

Contact us now to book your booth:

Contact: Mr. Cai 137 6167 1168 (same as WeChat)

Seize the opportunity and create the future. The exhibition is now open for consultation and comprehensive investment promotion. We look forward to you coming prepared and returning with a full load!

• Telephone:137 6167 1168
• Contact:Mr. Cai
• Mobile:137 6167 1168
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

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