CSIC 2026 chip rise, chip future

2026 China (Chengdu) Semiconductor and Integrated Circuit Industry Expo

Exhibition Background:

At present, the semiconductor industry in Chengdu has entered a stage of high-quality development. Chengdu will become one of the world's top 50 economic center cities by 2030, and the main revenue of Sichuan's electronic information industry is expected to exceed 1.2 trillion yuan by 2025, mainly concentrated in areas such as Chengdu High tech Industrial Development Zone, Chengdu Economic and Technological Development Zone, and Chengdu Tianfu New Area. Chengdu High tech Industrial Development Zone is an important science and technology innovation area in Chengdu, attracting the development of many integrated circuit enterprises, such as Intel, Texas Instruments, MediaTek, HiSilicon, Ziguang Spreadtrum, SMIC, Huawei, Samsung, TSMC, Changdian Technology, and China Microelectronics Corporation. The district has established important development carriers such as Chengdu High tech Electronic Industry Park, Chengdu Electronic Information Industry Functional Zone (High tech Zone and Pidu District), and Chengdu National "Xinhuo" Double Innovation Base. Meanwhile, there is also the ongoing construction of the Liandong U Valley Chengdu High tech Electronic Industrial Park.

In order to further strengthen the exchange and cooperation of the global semiconductor and integrated circuit industry supply chain, showcase the latest innovative technologies and achievements in the semiconductor industry, and promote the high-quality development of China's integrated circuit industry and economy and society, the 2026 China (Chengdu) Semiconductor and Integrated Circuit Industry Expo, hosted by Shanghai Chaobo Exhibition Co., Ltd., will be held at the Chengdu Century City New International Convention and Exhibition Center in April 2026

This conference will rely on the electronic information, semiconductor, and integrated circuit upstream and downstream industry chains to showcase equipment technology and set up related academic forums, attracting and gathering leaders of domestic and foreign semiconductor and integrated circuit regulatory departments, experts and scholars, industry leaders, technical elites, as well as well-known international and domestic institutions, organizations, and enterprises. It will analyze the latest progress and future development trends of the electronic information, semiconductor, and integrated circuit industry from multiple dimensions such as production and manufacturing, cutting-edge technology, industrial applications, and ecosystems, and combine Shaanxi's leading industries and regional characteristics to attract investment, promote local entrepreneurship, landing and development of electronic information, semiconductor, and integrated circuit upstream and downstream enterprises and institutions, and promote high-quality development of the electronic information industry in Shaanxi and western China, Forming a radiation driven innovation pilot zone in the western region and a national science and technology innovation growth pole.

essential information:

Name: China (Chengdu) Semiconductor and Integrated Circuit Industry Expo

Date: April 16-18, 2026

Location: Chengdu Century City New International Convention and Exhibition Center

Planned area: 20000 square meters of exhibition space, 500 exhibiting companies, and over 30000 visitors

Conference theme:

Rise of Chip, Future of Chip

Scope of exhibits:

(1) Equipment exhibition area: semiconductor wafer equipment, semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, etc;

(2) Material exhibition area: monocrystalline silicon, silicon wafers, photoresist, chemical reagents, electronic gases, polishing materials, metal target materials, compound semiconductor materials, etc;

(3) IC Design Exhibition Area: EDA, IP Design, Embedded Software, Digital Circuit Design, Analog and Mixed Signal Circuit Design, Integrated Circuit Layout Design, etc;

(4) Integrated circuit manufacturing exhibition area: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuit manufacturing, etc;

(5) Packaging and testing exhibition area: testing probe station, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, etc;

(6) Third Generation Semiconductor Zone: Materials and application technologies such as Gallium Nitride (GaN), Silicon Carbide (SiO), Zinc Oxide (Zn0), Diamond, etc;

(7) Electronic components exhibition area: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, electronic functional process special materials, diodes, transistor filtering elements, electronic adhesive (tape) products, electronic chemical materials and components, microwave components, communication equipment, microwave materials, microwave RF testing instruments, special software, etc;

(8) New displays: 0LED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays, VR displays, intelligent transportation displays, application terminal displays, flexible displays and materials and equipment, etc;

(9) Testing and measurement: electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

(10) Big data and artificial intelligence: big data and artificial intelligence, big data and intelligent manufacturing, big data and smart cities, big data and healthcare, big data and financial innovation, big data and e-commerce;

Special Forum Activities:

During the conference, multiple hot topic technology forums will be held, focusing on research and application promotion in the semiconductor and integrated circuit fields. Topics such as the industry chain ecosystem, industry education integration, docking, and technical exchanges will be discussed, inviting leading departments, industry leaders, experts and scholars, technical elites, as well as well-known international and domestic institutions, organizations, and enterprises in the semiconductor and integrated circuit fields to participate in in-depth academic, technological, and industrial exchanges.

Chengdu Power Semiconductor Development Forum

Advanced Packaging and Equipment Innovation Development Forum

2026 Electronic Information Equipment Intelligent Production Line Forum

New Display Technology and Semiconductor Industry Development Forum

Integrated Circuit Industry Chain Supply and Demand Matchmaking Conference

Sichuan Chongqing Semiconductor Industry Education Integration Cooperation Exchange Conference

Intended audience:

Intending to invite brand exhibitors: Changxin Storage, iFlytek, BYD, BOE, Jingyi, Guoxian, Xinyuan Microelectronics, Zhonghang Huace Science and Technology, Yuxin, Changyuan Power, Jiefa Technology, Lianfa Technology, Police Communication, Ximai Microelectronics, Mitsubishi Electric, Guopinwei, Jiemin Electronics, Tongfu Microelectronics, Xinhuicheng, Pinhe, Jiangfeng Electronics, Ultra Pure Application, Hill Electronics, Shilan Semiconductor, Daren Technology, Yuxin, Mingtai Microelectronics, Guangyi Microelectronics, Haiwei Huaxin, Xinhuo Microelectronics, Anmei Semiconductor, Yingjie Electric, Botai Electronics, Anxin Semiconductor, Intel, Texas Instruments, MediaTek, Hisilicon, Ziguang Zhan Rui

Upstream and downstream industrial chain: relevant personnel/experts and scholars from government regulatory departments, procurement, design/research and development, integration/engineering, projects, agents/distributors, corporate executives, production/process/testing, quality control, technical engineers, research experts, marketing/sales, information acquisition and compilation, etc

Organizing Committee Secretariat:

Contact: Manager Shen

Phone: 13003111528

• Telephone:13003111528
• Contact:Manager Shen
• Mobile:13003111528
• Address:No. 198 Century City Road, Wuhou District, Chengdu City, Sichuan Province

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