1. Exhibition Introduction: Against the backdrop of the "dual carbon" goal and the accelerated landing of the digital economy, liquid cooling technology is becoming the core temperature control solution in fields such as energy storage, data centers, and industrial manufacturing. With the increase in scene complexity (such as temperature difference control of energy storage PACK ± 1 ℃, data center PUE optimization below 1.1), standardized products are no longer able to meet differentiated needs. This negotiation meeting will revolve around negotiation and customization.
2. Data introduction: There are over 23000 special exhibitions, 1200 booths, 48000 professional visitors, 3500 buyers, and a total visitor flow of over 150000.
3. Target audience: We will focus on inviting executives from national, provincial, municipal, and relevant research institutions, as well as manufacturers, distributors, and agents in the fields of photovoltaics, food, power electronics equipment, pharmaceuticals, batteries, energy storage, servers, data centers, quick freezing, charging piles, and other related industries to visit and negotiate.

1. Core liquid cooling technology
1.1 Cold Plate Liquid Cooling System: An efficient heat dissipation solution for servers and chips, including core components such as liquid cooling plates and coolant.
1.2 Immersion liquid cooling equipment: a fully enclosed heat dissipation system that directly immerses electronic components in cooling liquid, suitable for high-density data centers.
1.3 Spray type liquid cooling technology: By accurately spraying coolant, local high-efficiency cooling is achieved, which is suitable for customized scene requirements.
2. Key components
2.1. Coolant (such as fluorinated liquid, water-based coolant)
2.2. Liquid cooled plates, liquid cooled pipes, quick couplings, pipelines, heat equalizing plate technology, pumps and solenoid valves, etc;
2.3. Thermal management modules for refrigeration cycle components such as compressors and evaporators;
3. Supporting materials
3.1. Thermal interface materials: liquid metal, phase change material, thermal grease;
3.2 Thermal insulation materials: aerogel, vacuum insulation board, used for system thermal insulation optimization;
3.3. Carbon based materials: Graphene thermal conductive film, carbon fiber gasket to improve heat dissipation efficiency;
2、 Customized temperature control services
1. Temperature control and heat dissipation technology: mixed cooling systems such as cold plate liquid cooling, immersion liquid cooling, and spray liquid cooling;
2. Integrated temperature control equipment: liquid cooled air conditioners, heat pump systems, miniature heat pipes, heat sharing plates, thermal management modules, liquid cooled cabinets, etc; ‌
3. Temperature control components and materials:
3.1 Key components: coolant (fluorine liquid, coolant, phase change coolant and additives), liquid cooled equipment (liquid cooled cabinets, heat exchangers, liquid cooled pumps/valves), connecting components (quick connectors, liquid cooled pipelines, solenoid valves);
3.2 Material innovation: thermal conductive materials (thermal conductive silicone grease, liquid metal, graphene thermal conductive film), thermal insulation materials: (aerogel thermal insulation felt, vacuum insulation board); ‌
3、 Testing and production equipment
4.1 Analytical instruments: leakage detector, thermal property measurement equipment;
4.2 Manufacturing equipment: vacuum injection machines, automated welding, packaging equipment, etc.

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Truename:Cai Gang
• E-mail:18710271575@vip.163.com
• Address:Room 8054, Zone 1, Building 1, No. 888 Huanhu West Second Road, Nanhui New Town, Pudong New Area

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