NEPCONJapanInternational Electronic Components and Manufacturing Technologyexhibition

Simultaneously held: Japan International Automotive Industry Exhibition AUTOMOTIVE WORLD

Exhibition Date: September 17-19, 2025

Exhibition location: Chiba Makuhari International Convention and Exhibition Center, Tokyo, Japan

Exhibition Date: October 29-31, 2025

Exhibition Hall Name: Nagoya International Convention and Exhibition Center, Japan

Exhibition Date: January 21-23, 2026

Exhibition location: Ariake International Convention and Exhibition Center, Tokyo, Japan

Exhibition Date: May 13-15, 2026

Exhibition location: INTEX OSAKA, Osaka International Convention and Exhibition Center, Japan

Host: RX Japan Co., Ltd. (formerly known as Reed Exhibitions Japan)

Chinese investment unit: Shanghai Fumao Exhibition Service Co., Ltd

Exhibition Consultation Hotline: Ms. Yan

Exhibition Profile

The NEPCON Electronics Exhibition in Japan has been held for over 30 years since 1972. In the early days, it was mainly a comprehensive exhibition focusing on electronic packaging and manufacturing, and it continued to grow and expand with the development of the Japanese electronics industry. In 2000, the organizers added exhibition sections on IC packaging technology, PCB, and electronic components, further enhancing the value of the exhibition and making it an "international comprehensive exhibition in the fields of electronic design, research and development, and manufacturing". In recent years, there have been new concurrent exhibitions for automotive electronics, electric vehicles, wearable devices, and LED/OLED lighting technology, gradually becoming a comprehensive exhibition representing the Asian electronics industry and the largest exhibition in Asia for electronic design, research and development, and manufacturing. The exhibition consists of seven professional exhibitions: Electronic Product Manufacturing Equipment and Component Technology Exhibition, Electronic Component Testing Equipment and Development Technology Exhibition, Electronic Component Packaging Equipment and Development Technology Exhibition, Printed Circuit Exhibition, Electronic Components and Materials Exhibition, Precision Processing Technology Exhibition, etc. It is a comprehensive exhibition that truly represents the Asian electronics industry. The January exhibition is known as the "barometer of the Asian electronics industry" with a core theme focused on "intelligence, green, and connectivity". The exhibits cover electronic manufacturing equipment, semiconductors and packaging, smart factory technology, and a special "Green Innovation Hall" is also set up. The concurrent events include international technology summits, industry leader roundtables, and more. The May exhibition is the Osaka version of NEPCON JAPAN, a leading electronics R&D and manufacturing exhibition in Asia. It provides a business exchange platform for local electronics companies and is expected to be visited by many electronics industry professionals. NEPCON JAPAN has attracted attention from the industry as an excellent place to learn about the latest technologies in the "future electronics industry", attracting more and more exhibitors and visitors from around the world!

Scope of exhibitsThe NEPCON exhibition in Japan has a wide range of exhibition content, mainly covering multiple fields such as electronic manufacturing equipment, electronic components, printed circuits, etc., and is composed of multiple professional exhibitions. Specifically, as follows:

1. Electronic Product Manufacturing Equipment and Component Technology Exhibition: Showcasing equipment such as surface mount machines, solder paste printing machines, dispensing devices, carriers, feeders, identification systems/inkjet printers, etc ERP/SCM、 Stamping machines, sealing machines, washing machines, electromechanical components, tools, software, rework/repair machines, face masks, tape weaving machines, carrier forming equipment, laser processors, precision welding machines, as well as factory control and adjustment systems, PCB separators and other related products.

2. Electronic Component Testing Equipment and Development Technology Exhibition: Exhibiting non-destructive testing equipment such as X-ray/gamma ray testing, ultrasonic testing, as well as other reliability and evaluation inspection equipment, to help manufacturers ensure product quality, connectors, wiring harnesses, switches, semiconductors, relays, power supplies, diodes, etc pcb、 Transformers, nylon cable ties, electronic materials, etc;

3. Electronic Component Packaging Equipment and Development Technology Exhibition: Focusing on the packaging technology of electronic components, showcasing assembly equipment, packaging materials, and IC packaging analysis software, providing cutting-edge packaging solutions for related enterprises.

4. Electronic Components and Materials Exhibition: covering various electronic components such as connectors, cables, sensors, transformers, nanomaterials, as well as the basic materials required for electronic products, to meet the market's demand for high-performance electronic components.

5. Printed Circuit Exhibition: Showcasing various equipment and materials related to printed circuits, including rigid, multi-layer, flexible, optical PCBs and related design software, promoting innovation in printed circuit technology.

6. Precision Machining Technology Exhibition: Focusing on various precision machining technologies such as stamping, cutting, drilling, and mirror grinding, reflecting the increasing trend of precision in the manufacturing industry.

7. Other: There may also be selected exhibition areas for 5G technology and AI facial recognition related products. At the same time, exhibitions usually have EMS/electronic foundry areas, providing EMS professional electronic manufacturing services, talent dispatch services, etc; There is also a welding area that displays welding machines, reflow soldering machines, welding materials (welding machines, reflow soldering machines, dismantling machines, soldering irons, solder slots, flux applicators, welding materials/fluxes); Dust free/electrostatic protection area: clean room, laminar flow hood, air shower room, particle counter, ion generator, anti-static products, dust-free supplies (dust-proof clothing/gloves/face shields), dust-free cloth, vacuum cleaner, other related products; Factory/plant equipment category: environmental protection/recycling products, plant equipment, environmental protection measures, storage containers (shelves, containers, etc.), various tools;

Cleaning equipment&cleaning agent area: wet cleaning equipment, dry cleaning equipment, cleaning agents, peripheral products, and related devices.

• Company:Shanghai Fumao Exhibition Service Co., Ltd
• Truename:Ms. Yan
• Mobile:17851331031
• Address:3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan

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