2026 Shenzhen International Electronic Components, Materials and Production Equipment Exhibition

Date: April 9-11, 2026

Location: Shenzhen Convention and Exhibition Center

150+technical forums; 1500+leading exhibitors; Over 80000 professional visitors; 100000 square meters+exhibition area

Organization

Organizational unit: Electronic Materials Science Branch of China Electronics Society

Organizer: Hengmai Exhibition (Shanghai) Co., Ltd

Exhibition Background

Manufacturers of electronic components, materials, and production equipment: The 2024 Shenzhen International Electronic Components, Materials, and Production Equipment Exhibition will be held from April 9-11, 2026, and will be showcased at the Shenzhen Convention and Exhibition Center. As one of the largest electronic exhibitions in Asia, this exhibition covers an area of 100000 square meters and will attract more than 1500 companies from around the world, 3000 booths, and 80000 visitors. We look forward to your visit.

Shenzhen is one of the important regions for the research and production of electronic materials and components in China. Currently and for a long time in the future, under the guidance of various policies and guidelines such as China's continuous deepening of reform, expansion of opening-up, adjustment of economic structure, and transformation of development mode, the electronic component industry in Shenzhen will usher in opportunities to promote industrial upgrading and implement independent innovation. The huge supporting demand brought by emerging industries and the industrial applications generated by the development trends of intelligence, green, low-carbon, and integration have presented a broad market prospect for the electronic components industry.

The "2026 Shenzhen International Electronic Components, Materials, and Production Equipment Exhibition" will showcase the latest products and technologies in the electronics industry and applications, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new trends in the future development of the electronics market, explore new demands in the future electronics market with a development perspective, innovate the connotation of the exhibition, and organize professional visitors from all aspects and levels, providing the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants.

Exhibition schedule

Report Exhibition: April 07-08, 2026 Opening Ceremony: April 09, 2026 09:30

Display transaction: April 9-11, 2026 Withdrawal: April 11, 2026 15:00

Top tier event

◎ A professional, authoritative and international event - ECMT 2026 will invite more than 1500 well-known enterprises from more than 20 countries and regions, including South Korea, Japan, Germany, the United States, the United Kingdom, Belgium, France, Italy, Taiwan, China, China, etc., with an exhibition area of 100000 square meters.

During the ECMT 2026 exhibition, a variety of comprehensive technical exchange activities and academic seminars will be held simultaneously, aiming to fully cooperate with the diversified promotional strategies of exhibitors and discuss hot topics in the industry. The cost per session is 30000 yuan for domestic enterprises and 5000 US dollars for foreign enterprises (the duration is 1 hour, and any time less than 1 hour will be charged per session).

Reason for participation

Collect the latest sales information and meet high-quality buyers from both domestic and international markets;

Understand future product demands and obtain the latest market development information;

Seeking new business opportunities through industry division of labor cooperation and industry chain demand;

An excellent platform for releasing new technologies and showcasing new products, gaining opportunities for market promotion and brand building, and increasing industry awareness;

Participate in relevant forum activities to learn about the latest industry trends and technological innovations.

Our goal will be to build an international procurement and trade platform, promote enterprise exchanges and cooperation, and improve exhibition effectiveness!

Exhibition scope

Electronic components: resistors, capacitors, potentiometers, inductors, electronic tubes, heat sinks, integrated circuits, passive components, sensitive components, wireless technology, storage devices, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, batteries, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramics, substrate substrates for printed circuits, electronic adhesive (tape) products, EMI/EMC electromagnetic compatibility technology, etc;

Switch, connector, plug-in and wiring harness exhibition area: electronic switches, toggle switches, boat switches, button switches, micro switches, rotary switches, keyboard switches; Terminal connectors, waterproof connectors, explosion-proof connectors, wire connectors, circular connectors, cable connectors, RF coaxial connectors, rectangular connectors, fiber optic connectors, audio connectors, household appliance connectors, military connectors, electronic connectors, power connectors, special connectors, industrial connectors, printed circuit connectors, heavy-duty connectors; Plug, socket, switch, terminal, terminal, connector contactor, silicone button, IC circular hole socket, pin, pin bank; Wiring terminals, insulation sheaths, wires, and insulation wrapping materials, etc; Electronic wires: power cords, audio and video cables, computer peripheral cables, automotive plug-in cables, wires, harnesses, zip ties, electromagnetic wires, sheathed wires, sight lines, high-temperature heat-resistant wires, etc; Various types of wiring equipment such as nylon cable ties, wiring troughs, wiring signs, wiring heads, wiring terminals, wire buckles, wire fixing heads, fixing bases, etc.

Electronic materials: magnetic materials, adhesive materials, heat dissipation materials, waterproof materials, welding materials, anti-static materials, dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloys, gas insulation medium materials, nanomaterials, insulation materials, electronic hardware, electrical ceramic materials, sensitive materials, packaging materials, piezoelectric crystal materials, electronic fine chemical materials, electronic lightweight construction materials, electronic tin solder materials, PCB manufacturing materials, optoelectronic materials, electromagnetic wave shielding materials, electronic functional process specific materials, electronic chemical materials and components, etc;

Electronic production equipment: wire harness and connector production equipment, coil production equipment, component manufacturing equipment, surface mount technology, welding technology, glue dispensing, coating equipment, testing and quality assurance, robots, motion control, drive technology, clean room technology, LED manufacturing equipment, material processing, organic and printed electronic products, battery and energy storage production technology, PCB and circuit carrier manufacturing, electronic special tools, etc;

Electronic instruments, testing and measurement, and electronic production automation technology: electronic instruments, electronic online testing instruments, electronic production automation technology products, environmental testing equipment, climate environment simulation testing equipment, mechanical environment simulation testing equipment, reliability testing equipment, etc;

Exhibition Tips

1. Please fill out the "Exhibition Application and Contract" form carefully and fax it to the organizing committee with the official seal.

2. After applying for a booth, exhibitors are required to wire transfer the booth fee to the designated account of the conference within 3 working days. After the remittance, please fax the remittance receipt to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not reserve the original booth.

3. The principle of booth sequence allocation is "apply first, pay first, arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the final right to adjust the booths of some exhibitors.

contact information

Hengmai Exhibition (Shanghai) Co., Ltd

Phone:+86-21-5415 5272

Contact: Liang Jiajin 136 8165 8788

here

• Telephone:136 8165 8788
• Truename:Liang Jiajin
• Mobile:136 8165 8788
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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