SEMI-e 2025 7th Shenzhen International Semiconductor Exhibition

Date: June 25-27, 2025

Location: Shenzhen International Convention and Exhibition Center (Hall 4/6/8, Bao'an New Building)

Host:
China Communications Industry Association
Shenzhen Semiconductor Industry Association
Jiangsu Semiconductor Industry Association
Zhejiang Semiconductor Industry Association
Chengdu Integrated Circuit Industry Association
Dongguan Integrated Circuit Industry Association
Shenzhen Zhongxin Materials Exhibition Co., Ltd
Undertaking Unit:
Shenzhen Zhongxin Materials Exhibition Co., Ltd

The 7th Shenzhen International Semiconductor Exhibition (SEMI-e) will be held from June 25-27, 2025 at Hall 4/6/8 of the Shenzhen International Convention and Exhibition Center (Bao'an New Hall)! This exhibition will focus on various sub sectors of the semiconductor industry, comprehensively showcasing new technologies, products, highlights, and trends in the semiconductor industry. It will gather over 850 leading enterprises and emerging exhibitors in design, chip, wafer manufacturing and packaging, semiconductor specialized equipment and components, advanced materials, third-generation semiconductors/IGBT, and automotive semiconductors, injecting new forces into the exhibition and showcasing the full "chip" strength.

SEMI-e has been deeply involved in the semiconductor exhibition field for many years and has developed into a highly influential and professional exhibition platform in South China, with over 70% of exhibitors renewing their contracts every year. The 7th SEMI-e 2025 Shenzhen International Semiconductor Exhibition will continue to cover an exhibition area of 60000 square meters, join hands with more than 850 exhibitors, and be jointly organized by multiple industry associations to launch exciting 50+themed activities. It is expected to attract 70000 visitors and provide a precise docking and two-way platform for the upgrading and development of the semiconductor industry chain!

The exhibits cover semiconductor equipment, design/chip/wafer manufacturing/advanced packaging, third-generation semiconductors, advanced materials for semiconductor components, automotive semiconductors, and other fields, covering the entire semiconductor industry chain. Focusing on hot topics such as automotive chips, autonomous driving technology, automotive power devices, advanced packaging and testing technology, and the preparation of new semiconductor (GaN/SiC) materials, we have attracted experts and experts from multiple fields including the semiconductor industry, automotive new energy, and consumer electronics to visit and exchange ideas on site, promoting capacity expansion and assisting in the deep docking of high-quality resources. SEMI-e is committed to providing exhibitors with a high-level, high-end, and high-quality platform for exhibition and communication!

Exhibition scope:

Semiconductor specialized equipment&components: thinning machine, single product furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc

Design, chip, wafer manufacturing and packaging: integrated circuit design and chip, wafer manufacturing, SiP advanced packaging, power device packaging and testing, MEMS packaging and testing, silicon wafer and IC packaging carrier board, packaging substrate and application manufacturing and packaging and testing EDA、MCU、 Packaging substrates, semiconductor materials, equipment, and components, etc

Advanced materials: silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresist and its supporting reagents, CMP polishing materials, materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc

Third generation semiconductors: gallium nitride (GaN) and silicon carbide (SiC), zinc oxide (ZnO), diamond, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc

IC carrier board/ceramic substrate: IC carrier board and packaging process (substrate, copper foil and other structural materials, dry film, gold salt and other chemicals/consumables) Chiplet packaging technology, storage, MEMS and chip applications and materials, equipment. Ceramic substrates, packaging materials, and equipment, etc

Components: Passive components, semiconductor discrete components/IGBT, 5G core components, special electronic components. Power management, sensors, storage devices, connector relays, cables, plug-in devices, oscillators, resistors, display devices, diodes, transistor filtering components, switches, and component materials and equipment, etc

In addition, from the perspective of the entire industry chain, Shenzhen, the host city, is undoubtedly one of the most dynamic cities for semiconductor trading in China, attracting the attention of many well-known enterprises and investors. Samsung Xi'an, Foxconn, Huawei Cloud, Star Semiconductor, SK Hynix Semiconductor, China Resources Microelectronics, Changjiang Storage, Huahong Hongli, Nvidia, STMicroelectronics, Huada Semiconductor, Infineon, Shanghai Beiling, Silan Microelectronics, Shichuang Electronics, Tongfu Microelectronics AIXTRON、 Professional buyers such as Huajin Semiconductor, Anshi Semiconductor, Xinju Energy, BYD, Hebei Tongguang, Tesla, NIO, Xiaopeng Motors, Xiaomi, BAIC New Energy, Great Wall Motors, FAW, SAIC Group, Northern Huachuang, Shanghai Microelectronics, Zhongwei Semiconductor, China Electronics Technology Group's 45th Research Institute, China Electronics Technology Group's 48th Research Institute, Shengmei Semiconductor, Huahai Qingke, Xinji Micro, Changchuan Technology, etc. visited the site to achieve accurate business matching through effective market exposure!

From comprehensive publicity and promotion to meticulous on-site service, the registration for the 7th Shenzhen International Semiconductor Exhibition (SEMI-E2025) is hot. We cordially invite familiar 'old friends' to make a comeback, and also welcome more' new faces' to continue joining us. We look forward to attending this highly influential and professional technology feast in South China with you!

Exhibition fee (Booth Rate)

★ Standard booth: 3mx3m=9 ㎡; Note: A 10% double opening fee will be charged for double opening. The standard booth includes carpet, three sided fence, company name signboard, one consultation table, two folding chairs, two spotlights, and one power outlet

★ Open space fee: (minimum rent of 36 square meters)

Please inquire for more information on the exhibition details and the latest booth map

(Contact Information)

Contact: Teacher Hu

Phone/Tel: 182 1090 8343

• Telephone:18210908343
• Truename:Teacher Hu
• Mobile:18210908343
• E-mail:1992129382@qq.com
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870