Semiconductor Exhibition [Official Website] 2025 Xi'an Semiconductor Industry Exhibition

2025 Xi'an International Semiconductor Industry Exhibition

Date: March 13-16, 2025 Location: Xi'an International Convention and Exhibition Center

High end products showcase seamless integration with high-end forums, leading the industry's development prospects

Organizer: Ancheng Exhibition (Shanghai) Co., Ltd

Exhibition Introduction

In recent years, China's semiconductor industry has grown rapidly and has become a globally active semiconductor market for trade. In addition, with the strong support of the Chinese government for the semiconductor industry, the development of the Chinese semiconductor industry is accelerating. During the 14th Five Year Plan period, China's semiconductor industry will have more comprehensive development and accelerate breakthroughs and applications of key core technologies in high-end chip design and other fields. The importance of the semiconductor industry is self-evident, as it serves as the foundation for various high-tech upgrades and permeates into various cutting-edge technological fields. China is a major consumer of semiconductors, accounting for one-third of global consumption each year, with imports reaching up to 300 billion US dollars, which is even higher than China's crude oil imports. The Chinese government's support for the semiconductor industry has been consistent, and as early as 2015, several industries including semiconductors were included as key industries in its "Made in China 2025" plan for strong support. The National Outline for Promoting the Development of Integrated Circuit Industry stipulates that by 2030, the main links of the integrated circuit industry chain should reach the international advanced level, and a group of enterprises should enter the international first tier.

In order to better promote the development of the semiconductor industry and with strong support from national regulatory authorities, the 2025 China (Xi'an) International Semiconductor Exhibition will be held from March 13 to 16, 2025 at the Xi'an International Convention and Exhibition Center. This exhibition focuses on integrating innovative products, technologies, solutions, and business cooperation models in the semiconductor industry, providing a one-stop solution platform for semiconductor enterprise brand promotion, product display, and exchange and cooperation, helping enterprises achieve communication and interoperability throughout the entire industry chain. As a semiconductor industry brand event that combines scale and influence, the exhibition follows market development trends and provides an opportunity for the domestic and international semiconductor industry to enhance brand awareness and expand markets. To create the largest and most valuable authoritative top-level event in the semiconductor industry, we look forward to your participation!

Exhibition Highlights

Heavy guests provided on-site support, experts led industry hotspots, and in addition to outstanding exhibitors, over 10 concurrent events and nearly 20 technical speeches were held during the exhibition, leading the collision of viewpoints. Representatives from over 80 of the top 100 companies gathered to showcase their strength in the PCB and supply chain industries.

Based on industry hotspots, through six major topics including intelligent human resources, low altitude economy, ESG and high-quality development, semiconductor localization development, advanced substrates, and automotive electronics, experts from relevant application fields such as the Institute of Microelectronics of the Chinese Academy of Sciences, Shenzhen Advanced Institute, Zeiss Group, North American OEM vehicle manufacturers, Yihang Intelligence, Kemi Technology, Magna Automotive Electronics, and Zhongke Xinsong have provided valuable references for the industry chain, taking into account the needs of application fields.

Audience groups visit, deepen interaction, and co create new scenes of industrial linkage

The three-day 2025 Electronic Semiconductor Industry Exhibition is an important practice of leading the industry chain upstream and downstream with technology. The conference will continue to be based on the Greater Bay Area, make an effective voice for the development of China's electronic semiconductor industry from the perspective of progressiveness and innovation of technology, and at the same time provide more "precise assistance" for the integration and extension of industrial fields.

Schedule arrangement

Exhibition setup: March 11-12, 2025 Opening: March 13, 2025

Exhibition: March 13-16, 2025 Withdrawal: March 16, 2025

Exhibition scope

Semiconductor and integrated circuit design, manufacturing, and packaging:

Integrated circuit design and chips, chip design tools, software and testing, wafer manufacturing, SIP advanced packaging, power device packaging and testing, MEMS packaging and testing, advanced packaging (Chiplet) technology, silicon wafers and IC packaging carriers, packaging substrates and application manufacturing and packaging testing, packaging substrate semiconductor materials and equipment and components, etc;

Equipment Manufacturing Zone:

Thinning machine, single crystal furnace, oxidation furnace, grinding, polishing, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, scribing, CVD/PVD/ALD, PECVD equipment MOCVD、 Glue coating, developing machine, solidification machine, cutting machine, cleaning equipment, mounting machine, burning, optical vacuum coating, imaging and testing measurement (microscope/spectrometer/interferometer/optical measurement and testing instrument/optical design software/optical platform and displacement table, etc.), optical instruments, lens and camera (lens/lens), laser equipment, bonding machine, testing machine, sorting machine, vacuum fluid, detection equipment, refrigeration equipment, oxidation equipment, oxidation equipment, clean room equipment;

◆ Semiconductor Materials Zone:

Third generation semiconductor materials, silicon wafers and silicon-based materials, optical masks, high-purity gases, electronic specialty gases, wet electron chemistry, photoresist and its supporting reagents, CMP polishing materials, target materials, optical fibers, packaging materials, nanomaterials, chip bonding materials, pipeline valves, crystals, quartz, sapphire, graphene, etc;

◆ Automotive Electronics:

Vehicle grade semiconductor control/AI chips, power semiconductors (IGBT and MOSFET), vehicle grade SiC modules, power management chips, automotive electronic micro assembly and power devices, advanced packaging technology for vehicle grade, intelligent networking, intelligent driving intelligent cockpit chips CPU and storage chips MCU, GPU image processing, vision processing chips, vision, sensing technology, radar technology, optical systems, intelligent decision-making technology, high-precision positioning and mapping systems, design and development, and testing solutions, etc;

◆ Electronic components:

Passive components, sensors, storage devices, connectors, relays, cables, wiring harnesses, plug-in devices, crystal oscillators, resistors, instruments, display devices, secondary and tertiary transistor filtering components, switches and component materials and equipment, ceramic magnetic materials, printed circuit substrates, etc;

◆ Testing and measurement:

Electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

New Display and Intelligent Terminal:

Display and applications, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc;

◆ Smart Power Zone:

Microwave RF, semiconductor LED, power management chip, plasma power supply, module power supply, laser power supply, AC, DC power supply, communication power supply, special power supply, power manufacturing equipment and auxiliary materials, power related software, photovoltaic/wind power/energy storage power supply design, military industry, power converter magnetic technology, etc;

Exhibition fees

Exhibition project specifications and requirements for domestic and foreign-funded enterprises

Exhibition project specifications and requirements for domestic and foreign-funded enterprises

Standard booth 3m ╳ 3m 14800 yuan/piece/exhibition period 28000 yuan/piece/exhibition period

Double booth 3m ╳ 3m 15800 yuan/piece/exhibition 29000 yuan/piece/exhibition period

The standard booth configuration includes: three wall panels per standard booth, two spotlights, one consultation table, two chairs, carpet, one 220V AC power outlet, Chinese and English fascia boards, etc. Indoor bare space booth without any configuration: (requires a minimum rental area of 36 square meters).

If you want to book a booth and learn more information, please contact us through the following methods:

Organizing Committee of China International Surface Treatment, Electroplating and Coating Exhibition

Phone: 021-57187692

Fax: 021-57187692

Exhibition consultation and registration:

Contact: Mr. Shen 15921245083 (same WeChat account)

• Telephone:15921245083
• Truename:Mr. Shen
• Mobile:15921245083
• Address:No. 1399, Huizhan 1st Road, Baqiao District, Xi'an City, Shaanxi Province

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