- Industry: Communications / Electronics
- Cycle: Once a year
- Time: 2024/04/24 - 04/26 (Wed To Fri Total 3 Days) Error Correction
- Address: Hubei Province Wuhan International Expo Center ChinaHubei provinceWuhan CityHanyang District 619 Yingwu Avenue, Hanyang District, Wuhan City
- Sponsor:Shanghai Fulun Exhibition Co., Ltd
- Organizer:Shanghai Fulun Exhibition Co., Ltd
INTRODUCTION
The 2024 Wuhan International Silicon Carbide Semiconductor Industry and Application Innovation Exhibition will focus on showcasing new products and technologies in the industry, establishing brand image for enterprises, promoting trade cooperation, market development, industry trends, strengthening production, research and development, and sales interaction. It will delve into the new trends of future development in domestic and foreign markets, explore the needs of future markets with a development perspective, innovate the exhibition content, and organize visitors from multiple aspects and levels, We strive to promote the development of business opportunities in the silicon carbide semiconductor industry and application innovation industry, and strive to create a mutually beneficial and win-win platform!
The 2024 Wuhan International Silicon Carbide Semiconductor Industry and Application Innovation Exhibition is scheduled to be held at the Wuhan International Expo Center from April 24th to 26th, 2024; The third China (Wuhan) Yangtze River Economic Belt Clean Energy Conference and the fourth China (Wuhan) New Power Industry Expo will be the theme exhibitions, as well as multiple technical seminars and activities held in the same area. And invite domestic and foreign experts and attending representatives to interact and exchange ideas, discuss industry development trends, share their respective experiences and achievements, while also taking a solid step towards industry exhibitions. At that time, we warmly welcome domestic and foreign enterprises and related industry professionals to visit and exchange ideas!
Audience invitation:Integrated circuits and third-generation semiconductor materials, devices, packaging and testing, equipment, applications, investment institutions, consumer electronics, industrial control electronics, communication electronics, semiconductor lighting, packaging, testing, new energy, power supply, home appliances, security, network communication, consumer electronics, automation equipment, automotive electronics, EMS foundries/OEM production, procurement, technology, research and development, media, etc;
Scope
1. Silicon carbide micro powder for precision ceramics, multi wire cutting silicon carbide micro powder, silicon carbide micro powder for coating abrasives, silicon carbide micro powder for foam ceramics, refractory grade silicon carbide micro powder, nanometer grade silicon carbide micro powder, battery cathode material silicon carbide micro powder, green silicon carbide grain sand, black silicon carbide grain sand, silicon carbide grain, aluminum matrix composites, aluminum matrix silicon carbide, aluminum nitride, silicon carbide smelting
Reactively sintered silicon carbide micro powder, pressureless sintered silicon carbide micro powder, precision grinding and polishing silicon carbide micro powder, locomotive brake device silicon carbide micro powder, new process silicon carbide micro powder for silicon carbon rods, etc;
2. Diamond micro powder series, coated diamond series, high-end copper conductors, copper alloy wires, flat panel display equipment, third-generation semiconductor equipment, packaging and assembly equipment, photovoltaic equipment, intelligent manufacturing, photovoltaic products, thermal equipment, sensors and systems, infrared device manufacturing equipment, DC parameter testers, semiconductor testing equipment, semiconductor discrete devices, chip design and manufacturing, device packaging testing, precision copper strips, precision special steel, precision optical testing, precision laser processing, testing equipment, image measuring instruments, laser marking equipment, laser micro processing equipment, device packaging testing, power semiconductor testing systems, rectifying devices, protective devices, silicon carbide chips, copper cores, aluminum core electromagnetic wires, LED sapphire substrates, silicon carbide substrates etc;
Costs & Precautions
Contact
- Company:Shanghai Fulun Exhibition Co., Ltd
- Truename:Mr. Tang
- Mobile:13262250859
- Address:619 Yingwu Avenue, Hanyang District, Wuhan City
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870
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