2027 Hangzhou Thermal Management Heat Dissipation Materials Exhibition

2027 China Hangzhou Thermal Management and Cooling Technology Conference and Exhibition

Hangzhou Station:

Exhibition Date: February 25-27, 2027

Exhibition Location: Hangzhou International Expo Center (G20 Main Venue)

Shanghai Station:

Exhibition time: August 05-07, 2026

Exhibition Address: New International Expo Center (No. 2345)

Theme: Leading the Future with Liquid, Smart Chain Win win

With the rapid development of the global new energy industry, thermal management and liquid cooling technology have become core demands in fields such as new energy vehicles, energy storage, data centers, and AI computing power. According to industry forecasts, the scale of liquid cooling is expected to reach 3.5 billion US dollars by 2028, accounting for nearly one-third of the total expenditure on thermal management, and the market size is expected to significantly expand. With the development of the computing power server industry towards modular and secure systems, liquid cooling technology will also move towards modularization and standardization. Especially in scenarios such as battery thermal management, high computing power heat dissipation, and energy storage temperature control, the penetration rate continues to increase. The popularization of liquid cooling technology has led server manufacturers and ecosystem service providers to actively layout and jointly promote the improvement and development of the liquid cooling ecosystem.

In the context of the development of new quality productivity, the core demands of consumer electronics, power electronics, artificial intelligence, 5G communication, data centers, Internet of Things, power batteries, new energy vehicles, energy storage, and new energy fields have jointly promoted the development of efficient and innovative technological solutions for thermal management. These fields not only require terminal devices to have higher efficiency, reliability, and safety, but also emphasize their durability and sustained stability, all of which rely on advanced heat dissipation systems as support.

Therefore, the 2027 China Hangzhou Thermal Management and Cooling Technology Conference and Exhibition will be grandly held from February 25-27 at the Hangzhou International Expo Center (G20 main venue). This exhibition focuses on the theme of "Leading the Future with Intelligent Chain Win Win", showcasing the latest products and technologies in the new energy thermal management liquid cooling industry. It establishes a brand image for enterprises, promotes trade cooperation and market development, leads the rapid development of the industry, and deeply understands the new trends in the future development of the domestic and international liquid cooling industry market. It provides the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants. At that time, we warmly welcome domestic and foreign liquid cooling industry enterprises and related industry professionals to visit and exchange ideas!

Co sponsoring and strategic cooperation: China Information Association Embodied Intelligence Professional Committee, Info Conference and Exhibition (Shanghai) Co., Ltd., Hangzhou Science and Technology Innovation and Entrepreneurship Association, Hangzhou Digital Economy Federation, Hangzhou Artificial Intelligence Society, Zhejiang Big Data Industry Technology Alliance, Jiangsu Automotive Engineering Society, Guangdong Automotive Engineering Society, EVH100O Electric Vehicle Thousand Talents Association, Yangtze River Delta (Hangzhou) Manufacturing Digital Competence Center, Zhejiang Turing Internet Research Institute, Wuxi Computing Industry Development Alliance, Wuxi Artificial Intelligence Industry Association, Yangzhou Digital Economy Federation, Yangzhou Artificial Intelligence Society, Shenzhen Chip Technology Promotion Association, Jiaxing Artificial Intelligence Industry Federation, Changzhou Industrial Robot Association

Organizer: Jiangsu Yingfo Conference and Exhibition Co., Ltd., Bike Exhibition (Shanghai) Co., Ltd

Concurrent Events

2027 Hangzhou International Data Center Liquid Cooling and Heat Dissipation Technology Exhibition

Exhibition value

1 Relying on Hangzhou's digital economy ecology, we can accurately reach the core procurement circle: Hangzhou, as the core hub of the digital economy in the Yangtze River Delta, has a huge computing cluster, Internet powerhouse and new energy industry chain. The exhibition landing in Hangzhou can deeply bind to the local mature computing industry ecosystem, directly targeting core user groups such as data centers, intelligent computing centers, communication operators, and new energy storage. Combined with the complete industrial chain supporting facilities in the Yangtze River Delta, exhibitions can efficiently facilitate upstream and downstream supply and demand docking, achieving a closed loop from technology display to order landing.

2. Seize the market opportunity: February (especially in the middle and late stages after the resumption of work during the Spring Festival) is a critical window for enterprises to formulate their annual procurement plans, budget plans, and technical routes. At this time, actively participate in the "First Exhibition of the New Year" and accurately undertake the procurement needs and technology selection of the enterprise for the new year. We can take this opportunity to launch our annual innovative products, seize market attention in the first place, and establish our position as the industry benchmark for the whole year. This exhibition covers markets with demand for liquid cooling and heat dissipation in the billions of yuan range, such as new energy vehicles, energy storage, and data centers; Reach global buyers and expand opportunities for cooperation in emerging fields both domestically and internationally.

3 Integration of resources in the whole industry chain: we mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation/aerospace, new energy vehicles, charging piles, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate. Directly connect with material suppliers, core component manufacturers, and end application enterprises;

4. Technology Trend Outlook: Master the latest development direction of liquid cooling and heat dissipation technology, from material innovation to system integration; Insight into the application opportunities of cutting-edge scenarios such as energy storage thermal management and low altitude economy.

5. Brand influence enhancement: Enhance industry visibility through summit forum speeches, media interviews, and white paper collaborations; Establish a technological leadership position among professional audiences and decision-makers.

Supporting activity planning

1. Cracking the bottleneck of high-power density heat dissipation, scaling up the implementation of cold plate and submerged liquid cooling technologies, energy consumption control and low-carbon computing power system construction for intelligent computing centers PUE, and optimization solutions for high-density server heat dissipation.

2. Diamond heat dissipation and new material applications: The heat flux density in fields such as AI chips, high-performance computing, and third-generation semiconductors continues to break through, and high heat flux density heat dissipation has become a key bottleneck restricting industrial upgrading.

3. Mass production and cost reduction of ultimate heat dissipation materials such as diamond, research and development of ultra-high thermal conductivity interface materials (TIM), AI chip specific liquid cooling systems, and packaging thermal management technology.

4. Special liquid cooled temperature control system for power batteries/energy storage power stations, domestic alternative solutions for thermal management of on-board power devices, and the application of phase change materials (PCM) in energy storage thermal management.

5. The construction of the Yangtze River Delta computing power park and the coordinated low-carbon development of computing and electronics, as well as the precise integration of the upstream and downstream of the liquid cooling industry chain (such as the collaboration between liquid cooling media, key components, and complete machine factories).

Display scope:

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Diamond thermal management core exhibition area: CVD single crystal/polycrystalline diamond heat sink, diamond copper/aluminum composite substrate, diamond thermal conductive micro powder, diamond heat dissipation film, diamond IGBT substrate, MPCVD diamond growth equipment, diamond cutting and grinding precision machining equipment, diamond encapsulated heat dissipation components.

Thermal conductive fillers: inorganic non-metallic materials such as aluminum oxide, silicon oxide, zinc oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, beryllium oxide, graphite, carbon black, etc; Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal concentrate; Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

Thermal conductive polymers: Thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal conductive insulating plastics, thermal conductive rubber, etc

Advanced thermal management materials: aluminum nitride/silicon nitride ceramic substrate, graphite heat conduction film, graphene heat dissipation materials, liquid metal, ceramic based heat conduction materials, metal based heat dissipation materials and other heat conduction gel/gaskets, phase change materials, aerogel heat insulation materials, indium based thermal interface materials, high heat conduction sealant.

Phase change materials (thermal storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt hydrates, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

Thermal conduction and heat dissipation components: heat pipes/heat sharing plates, copper-clad laminates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFET, IGBT), etc

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, metal stamping parts, chassis, cooling pads, finned tubes, heat pipes, heat plates, cooling, touch panels, fan grille, fan, motor, motor, fan automatic assembly machine, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, heat pipe, plug-in heat sink, plug-in heat sink, chassis integrated heat sink, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, rib heat sink, frequency conversion heat sink, heat pipe heat sink, forked heat sink, liquid cooling heat sink, combination heat sink, heat sink for solid-state relays, high-power transistor heat sink and related accessories, etc;

New energy thermal vehicle management related technical products: liquid cooling technology, air cooling technology, electric compressor, PTC heater, constant temperature water tank, heat pump, coolant, refrigerant, battery cooling plate, cooler, electronic expansion valve, radiator, heat exchanger, evaporator, condenser, electronic fan, electronic water pump, antifreeze, sealant, structural adhesive, thermal conductive adhesive, potting adhesive, foam adhesive, phase change material, etc

New energy vehicle thermal management system: motor electronic control, powertrain thermal management system, air conditioning thermal management system, power battery, fuel cell thermal management system, cooling system, water-cooled plate, evaporator, condenser, liquid cooled plate, aluminum heat transfer material, thermal simulation, electronic water pump/water valve, insulation/thermal conductivity material, high and low temperature equipment/constant temperature equipment, simulation software, filters, fans, heat pumps, compressors, pipelines and other product accessory production equipment.

Core components of liquid cooling system: cold plate liquid cooling products (microchannel cold plate, modular cold plate, lightweight cold plate); Immersion liquid cooled cabin (single-phase/two-phase immersion system, cooling medium); Liquid cooled pipelines and connectors (pipelines, sealed joints).

Liquid cooling technology solutions: cold plate, immersion, and spray liquid cooling technologies; Intelligent temperature control technology, simulation and design.

Energy storage thermal management temperature control system: liquid/air cooling temperature control scheme, energy storage battery thermal management scheme, heat exchanger, fire and safety system.

Thermal runaway monitoring: temperature sensor, gas sensor, battery management system.

Thermal storage management: phase change materials, thermal storage and exchange devices, phase change thermal storage system solutions.

Data center liquid cooling: cooling scheme for cold plate/submerged servers, liquid cooling pipeline system. Aluminum, copper, ammonia testing, brazing, insulation plastic, processing equipment and other essential components: quick connectors, liquid cooling pipelines, water separators, expansion valves, throttle valves, solenoid valves, pumps, compressors, evaporators, heat exchangers, chassis, cooling distribution units, filtration and purification devices, cold plate liquid cooling heat transfer enhancement technology, immersion liquid cooling heat transfer enhancement technology, spray liquid cooling technology, two-phase flow (pumping) cooling technology, data center liquid cooling system thermal simulation, immersion liquid cooling material compatibility, quick connector technology, electronic fluorine liquid, electronic coolant, refrigerant, silicone oil, water-based coolant, liquid cooling heat dissipation module, liquid cooling system design, liquid cooling materials, liquid cooling components, leakage detection technology Intelligent fluid distribution technology, intelligent temperature monitoring technology;

Applications of data centers: modular data centers, data cloud boxes, data center solutions, batteries, energy storage, dedicated air conditioning and fresh air systems for data centers, UPS uninterruptible power supplies, security, comprehensive cabling, green data centers, data center maintenance and other systems and solutions;

Low altitude economy and emerging fields: aircraft thermal management, humanoid robot joint heat dissipation.

Testing and precision machining equipment: CNC machining centers, vacuum brazing production lines, friction stir welding equipment, dispensing machines, coating/laminating equipment, vacuum injection machines, helium leak detection equipment, ultrasonic flaw detectors, fluid pressure testing systems. Analytical instruments, laser thermal conductivity meter, thermal conductivity analyzer, thermal conductivity meter, thermal expansion meter, electronic thermal tester, air volume and pressure tester, laser thermal conductivity measurement instrument, material strength testing machine, thermal property measurement equipment

Thermal design: thermal simulation/thermal design software, etc; Thermal management solutions: air cooling technology, liquid cooling technology, 3D printing, etc; Thermal analysis: standards, testing, certification, external testing service platforms (universities/research institutes), etc.

Booth fees: Please call to inquire.

Standard booth: (3M x 3M) booth (including three side panels, fascia board, one table and two chairs, 220V power sockets, cleaning fees, etc.).

Open space: does not include any supporting facilities, and can be rented separately if needed. New technology launch event, new product promotion event, and specialized seminar

If enterprises need to arrange such activities, please contact the organizing committee of the conference in a timely manner to arrange a better time slot.

Please communicate and contact us in a timely manner to obtain the latest exhibition information

Contact: Manager Wang 19261219096

Fax: 021-51062285

2027 Shanghai International Thermal Management and Cooling Technology Conference and Exhibition

Time: August 05-07, 2027

Address: Shanghai New International Expo Center (No. 2345)

Contact: Manager Wang 19261219096

• Telephone:19261219096
• Contact:Manager Wang
• Mobile:19261219096
• Address:No. 353 Benjing Avenue, Xiaoshan District, Hangzhou City, Zhejiang Province

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