Semiconductor, as the "industrial heart" of the digital age, is the core cornerstone supporting strategic industries such as artificial intelligence, new energy vehicles, and advanced computing. It is also a key force for the country to cultivate new quality productivity and achieve technological self-reliance and self-improvement. The 2nd China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition (CICE2027 · Wanxin Exhibition) will be held at the Binhu International Convention and Exhibition Center in Hefei from May 18-20, 2027. With the theme of "Winning the Chip Era, Co creating the Future of Chips", this exhibition is based on the industrial heritage of Hefei as the "IC Capital of China", relying on the development dividends of the Yangtze River Delta integration. With a 30000 square meter exhibition area, 600+enterprises, and 30000+professional visitors, it creates an international, professional, and full chain industry event, witnessing the key leap of China's semiconductor industry from "catching up" to "leading".

Industrial highland: Hefei builds a semiconductor "full chain ecosystem" with full confidence

As the third pole of integrated circuits in the Yangtze River Delta region, Hefei has built the most complete semiconductor industry chain ecosystem in China based on the trillion yuan industrial cluster of "chip screen automotive integration", and has become a core force in the global semiconductor industry restructuring. In 2027, the semiconductor industry in Hefei will usher in a key node of concentrated capacity release and comprehensive technological breakthroughs, providing solid industrial support for the Anhui Semiconductor Industry Exhibition.

In the field of automotive regulations and third-generation semiconductors, Hefei's "chip screen automotive integration" is deeply coordinated. By 2027, the production capacity of new energy vehicles in Hefei is expected to reach 3.4 million units. The demand for automotive grade chips has exploded, and companies such as Jinghe Integrated and Anshi Semiconductor are accelerating the landing of automotive grade products. The Anhui Automotive Chip CIDM Alliance is promoting the linkage between vehicle, Tier 1, and chip companies to build an automotive grade chip ecosystem. In the field of third-generation semiconductors, Lushao Technology has achieved mass production of 8-inch conductive SiC substrates and Century Gold Core 6-inch silicon carbide single crystals, with key parameters reaching international advanced levels, suitable for high-end scenarios such as new energy vehicles and photovoltaics, becoming a new growth pole for the semiconductor industry in Hefei.

Event Upgrade: CICE2027 Anhui Chip Exhibition, Full Chain Convergence, Colorful Highlights

As the annual benchmark exhibition for the semiconductor industry in Hefei, CICE2027 Anhui Semiconductor Exhibition has been fully upgraded on the basis of its successful first event in 2026. With "full chain coverage, hardcore display, precise docking, and ecological co construction" as its core, it aims to create an international high-end platform that integrates technology display, business docking, academic exchange, and ecological co construction.

Full chain exhibition area, covering all core areas in one go

The exhibition accurately laid out 11 core exhibition areas, achieving seamless coverage of the entire chain from design to manufacturing, packaging and testing, equipment, materials, and application. The IC design exhibition area focuses on cutting-edge products such as AI chips, automotive grade chips, storage chips, RF chips, etc; The wafer manufacturing exhibition area showcases 12 inch advanced production capacity, unique processes, and intelligent manufacturing solutions; The packaging and testing exhibition area focuses on advanced packaging (SiP/3D), high-end storage packaging and testing, and automotive grade packaging and testing technologies; The semiconductor equipment and materials exhibition area gathers key domestic achievements such as lithography machines, etching machines, target materials, electronic specialty gases, and photomasks; The "Chip Screen Automotive Integration" application ecosystem zone links the display, automotive, industrial/AI fields to showcase the collaborative innovation achievements of chips and terminals.

Hardcore debut, centralized review of domestic substitution achievements

CICE2027 will become a centralized review venue for domestic substitution achievements, and a batch of benchmark technologies and products will be launched with great weight. Changxin Storage's 17nm DRAM chip and Crystal Integrated 28nm automotive grade OLED driver chip will make their first public appearance; Anhui Jingmagnesium 28nm photomask and Hefei Peidun high-end storage packaging and testing solution were released on site; Enterprises such as Northern Huachuang and Zhongwei bring new generation etching machines and thin film deposition equipment; Lu Xiao Technology and Century Gold Core showcased their 8-inch SiC substrate mass production technology, highlighting China's firm determination to break through overseas monopolies and achieve independent and controllable semiconductor industry.

High end forum, monitoring new trends in industrial development

At the same time as the exhibition, more than 20 high-end forums and closed door matchmaking sessions will be held, bringing together global industry experts, business leaders, investment institutions, and research institutes to share cutting-edge technologies, analyze industry trends, consolidate cooperation consensus, and contribute wisdom to the high-quality development of the industry, focusing on core topics such as "advanced process evolution and mature process opportunities", "localization path of automotive grade chips", "independent and controllable strategy of storage chips", "domestic substitution of semiconductor equipment materials", "commercialization of third-generation semiconductors", and "innovation of advanced packaging technology".

Accurate docking, building an efficient business cooperation platform

To solve the problem of asymmetric supply and demand information in the industrial chain, the exhibition innovatively launched exclusive activities such as "precise matching between exhibitors and buyers", "upstream and downstream docking meetings in the industrial chain", and "investment and financing roadshows". Accurately invite end buyers in the fields of new energy vehicles, display panels, data centers, consumer electronics, etc., and negotiate face-to-face with chip design, manufacturing, packaging and testing, equipment and material enterprises; Build a semiconductor industry investment and financing platform, linking high-quality projects with capital resources; Promote the synergy of industrial clusters in the Yangtze River Delta, Guangdong Hong Kong Macao Greater Bay Area, Beijing Tianjin Hebei and other regions, facilitate the free flow of technology, talent, capital and other factors, and build an open and win-win industrial ecology.

Co creating the future: Wanxin Exhibition builds bridges and empowers high-quality industrial development

The development of the semiconductor industry in Hefei, from the "Hefei model" leading the rise of the industry to the establishment of a global communication platform at Wanxin Exhibition, is a vivid epitome of China's technological self-reliance and self-improvement. In 2027, the global semiconductor industry will accelerate its restructuring, and domestic substitution will enter the deep-water zone. As the "IC Capital of China", Hefei shoulders the important mission of promoting industrial upgrading and leading innovative development.

CICE2027 Wanxin Exhibition is not only a grand event showcasing technology and products, but also a feast of opportunities for industrial resource integration and win-win cooperation. Here, global industry elites gather together to discuss new opportunities in the semiconductor industry; Here, domestic hardcore technology is showcased, showcasing the power of Chinese chips; Here, the upstream and downstream of the industrial chain are deeply connected, gathering collaborative development forces.

Winning in the era of chip technology, co creating the future of chip technology! On May 18-20, 2027, at the Hefei Binhu International Convention and Exhibition Center, CICE2027 Anhui Semiconductor Exhibition cordially invites global semiconductor colleagues to gather in Luzhou to appreciate the new appearance of the industry, explore innovative paths, and draw development blueprints together. Together, we will promote China's semiconductor industry to move towards the high-end of the global value chain and inject strong "chip" power into the development of the digital economy!

professional visitor

1. Integrated circuit design, wafer manufacturing, specialty process outsourcing, IDM vertical integration, advanced packaging testing and other full chain enterprises; Upstream and downstream research and development, production, procurement, and operation teams for high-end semiconductor equipment, core precision components, high-purity semiconductor materials, lithography supporting materials, packaging materials, etc; EDA software, IP core, layout verification, testing verification, yield optimization, failure analysis and other technical service organizations.

2. Enterprises producing wide bandgap semiconductor materials and devices such as silicon carbide, gallium nitride, gallium oxide, gallium arsenide, and indium phosphide; Research and development manufacturers of power semiconductor modules, RF microwave devices, and high-speed communication devices; We are a solution integrator and terminal procurement enterprise targeting the fields of new energy vehicles, photovoltaic energy storage, industrial power supply, 5G/6G communication, aerospace information, and microwave radar.

3. Core procurement enterprise for terminal applications

New display field: terminal enterprises such as Mini/Micro LED, OLED, car displays, flexible displays, ultra high definition displays, and upstream and downstream supporting supply chain enterprises.

In the field of automotive electronics: vehicle manufacturers, new energy vehicle companies, and Tier 1 core component manufacturers, focusing on the research and procurement teams of automotive grade chips, intelligent driving, in vehicle electronic control systems, and battery management systems.

AI computing power and data center: cloud computing, AI big model, data center, AI server enterprises, covering the selection, procurement and technical research and development teams of computing chips, high-speed optical modules, silicon optical integration, edge computing and other products.

High end manufacturing and general terminal fields: high-end terminal application enterprises such as industrial automation, intelligent equipment, industrial robots, consumer electronics, optical communication, aerospace, national defense and military industry, medical electronics, and new energy storage.

4. A research and development, production, procurement, and supply chain support enterprise for automotive grade, industrial grade resistive capacitive components, power discrete devices, high-end connectors, intelligent sensors, high-frequency, high-speed, and automotive grade PCBs, microwave and RF devices, special electronic materials, and electromechanical supporting components.

5. Local departments in charge of industry and information technology, industrial parks, science and technology innovation parks, and investment operation platforms; National semiconductor industry associations, societies, and standardization organizations; Higher education institutions, research institutes, and industry university research innovation platforms; Third party testing and certification, intellectual property, trade distribution, industry supporting service providers, and industry professional media.

6. Semiconductor special industry funds, venture capital institutions, financial investment companies, securities research teams, and various industry investment and financing platforms.

7. Core positions such as corporate executives, technical directors, R&D engineers, process engineers, equipment engineers, testing engineers, product managers, procurement directors, supply chain managers, project decision-makers, and market operation backbone personnel.

• Contact:Liu Jiao
• Mobile:13257086620
• E-mail:243163521@qq.com
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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