With the continuous and rapid development of the electronic materials industry and the downstream electronic devices gradually moving towards miniaturization, slimness, and low cost, microelectronic soldering technology is also constantly expanding, especially with the widespread application of reflow soldering technology, which has led to a gradual increase in the proportion of solder paste products in microelectronic soldering materials. Foreign enterprises have significant advantages in technology research and development, product quality, and market share. They have stronger research and development capabilities and rich experience, capable of producing high-performance, high reliability products to meet high-end electronic manufacturing needs. With the widespread application of electronic products, the demand for electronic grade tin solder continues to grow. Tin solder is an essential material, especially in the manufacturing of smartphones, computers, and other electronic devices. Electronic grade tin solder has evolved from traditional tin lead alloy electronic solder materials to various series of alloy solder materials, including low-temperature solder (tin bismuth alloy, tin indium alloy), medium temperature solder (tin zinc alloy, tin copper alloy, tin silver copper alloy), and high-temperature solder (tin antimony alloy, tin gold alloy). Among them, tin silver copper alloy and tin bismuth alloy are the main electronic assembly welding materials.

In the rapidly changing era of electronic technology, every small innovation can trigger a disruptive change in the industry. The importance of electronic grade tin solder as a bridge connecting electronic components is self-evident. With the rapid development of technologies such as 5G communication, Internet of Things, and artificial intelligence, the performance requirements for electronic products are increasing day by day. Electronic grade tin solder, as a key material, is experiencing unprecedented market growth. Its high conductivity, low melting point, good soldering performance, and environmental characteristics make it play a crucial role in various fields such as semiconductor packaging, PCB board manufacturing, automotive electronics, and consumer electronics. Automation and intelligence are important directions for the high-end development of the industry and key means for enterprises to enhance their market competitiveness. On the one hand, improving the level of production automation and intelligence helps to enhance efficiency and reduce costs; On the other hand, companies with this capability have a greater advantage in product stability and reliability. With the acceleration of product updates and the intensification of import substitution trends in downstream application fields, some small and medium-sized enterprises face the risk of elimination due to weak technical strength and small production scale. Enterprises with advantages in formula research and development, product preparation technology, and production scale will expand their market share, and industry concentration will continue to increase.

Electronic grade tin solder, as an indispensable key material in the electronic manufacturing industry, is facing unprecedented market opportunities with the booming development of the global electronics industry. Its significant welding performance, environmental characteristics, and wide range of application fields make it an important force in promoting the transformation and upgrading of the electronic manufacturing industry. In the face of the future, the electronic grade tin solder industry needs to continue to increase technological innovation, improve product quality and environmental standards to meet the constantly changing demands of the market. Meanwhile, strengthening international cooperation and exchanges to jointly address sustainable development challenges will be the key to promoting the sustainable and healthy development of the industry. Looking ahead, electronic grade solder will play a more important role in the global electronic manufacturing industry, contributing to the construction of a more intelligent, green, and efficient electronic world. This exhibition is an industry international brand event held in accordance with the principles of "specialization, internationalization, and branding". With both government support and the participation of industry authorities, its consistent style of "clear themes, prominent characteristics, emphasis on effectiveness, and continuous innovation" has led to an increasing popularity and influence in the industry. Industry insiders have regarded it as the best platform for "understanding industry information, grasping market trends, showcasing corporate brands, expanding trade channels, and seeking cooperation opportunities".

1. Soldering Materials: Soldering Rod, Soldering Wire, Soldering Rod, Soldering Wire, Fine Tin Ingot, Electrolytic Tin Ingot, Copper Aluminum Flux Core Welding Wire, Copper Aluminum Welding Wire, Solder Paste (Solder Paste), Lead Tin Paste, Environmentally friendly Solder Paste, Low Temperature Solder Paste, LED Solder Paste, Flux, Thinner, Soldering Aluminum Tin

Wire, stainless steel tin wire, tin ball, tin deposit, anode rod, solder paste, red glue, flux, etc., halogen-free flux, halogen-free solder wire, lead-free solder, lead-free solder wire, lead-free solder bar, no cleaning flux, resin type flux, water-soluble flux, aluminum solder, aluminum flux, aluminum enameled wire special solder wire, aluminum lamp head solder wire, aluminum brazing materials and other related electronic soldering materials;

2. Soldering equipment: Soldering robots, dual head dual axis/multi head multi axis soldering robots, laser soldering robots, dual slide automatic soldering robots, universal soldering machines, lead-free soldering machines, automatic solder paste printing machines, tin furnace immersion soldering equipment, automatic lead-free peak soldering machines

Fully automatic lead-free reflow soldering machine, PCB board soldering robot, circuit board soldering robot, robotic soldering robot, plug-in automatic soldering robot, soldering smoke removal equipment;

• Company:Shanghai Yewen Exhibition Service Co., Ltd
• Telephone:021-54388602
• Contact:Li Cheng
• Mobile:13122870856
• E-mail:2410927403@qq.com
• Address:No. 111 Fuhua 3rd Road, Fu'an Community, Futian Street, Futian District, Shenzhen City, Guangdong Province

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