2026 China Shenzhen International Integrated Circuit and Semiconductor Industry Expo
- Industry: Communications / Electronics
- Cycle: Once a year
- Time: 2026/04/09 - 04/11 (Thur To Sat Total 3 Days) Error Correction
- Address: Guangdong Shenzhen Convention and Exhibition Center (Futian District) ChinaGuangdong ProvinceShenzhenFutian District Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province
- Sponsor:Shanghai Kaixuan Exhibition Service Co., Ltd
- Organizer:Shanghai Kaixuan Exhibition Service Co., Ltd
INTRODUCTION
Date: April 9-11, 2026
Location: Shenzhen Convention and Exhibition Center
The chip industry is the core of the information technology industry, a strategic, fundamental, and leading industry that supports economic and social development and safeguards national security. It is an important development direction determined by multiple national strategic plans and has significant implications for achieving technological self-reliance and supporting the shift towards high-quality economic development.
By the end of 2021, there are nearly 3000 chip design companies in Chinese Mainland, and Huawei HiSilicon is among the top companies in the world. However, the chip design industry is still dominated by American companies, with the United States accounting for 60% of the global chip design share and China accounting for 10%. The gap is still large.
From the demand side, Chinese Mainland is the world's largest semiconductor consumer market. In 2021, the market size of Chinese Mainland will be 192.5 billion US dollars, accounting for 34.6%, ranking first in the world and the largest semiconductor consumer market in the world. From this data, China's demand accounts for more than half of the Asian region, 13% more than the United States, and 26% more than Europe and Japan.
In China's 14th Five Year Plan, it is clearly stated that we need to accelerate the development of integrated circuits, chips, and semiconductor industries, promote innovation in computing chips, storage chips, and other fields, accelerate the research and development of key materials such as integrated circuit design tools, key equipment, and high-purity target materials, and promote breakthroughs in characteristic processes such as insulated gate bipolar transistors (IGBT) and microelectromechanical systems (MEMS). Layout strategic cutting-edge technologies.
The National Development and Reform Commission and the Ministry of Commerce jointly issued the "Opinions on Several Special Measures for Relaxing Market Access in Shenzhen's Construction of a Leading Demonstration Zone for Socialism with Chinese Characteristics". The Opinion proposes to innovate market access methods and establish electronic component and integrated circuit trading platforms. Support Shenzhen in optimizing the layout of similar trading venues, establishing a market-oriented international trading center for electronic components and integrated circuits, creating a new platform for market access for electronic components, integrated circuit enterprises, and products, and promoting the aggregation, integration, and cluster development of upstream and downstream supply chains and industrial chains.
The Opinion has connected multiple key nodes in the supply chain of electronic components and integrated circuits, strengthened collaborative innovation in the industry chain, promoted the development of upstream and downstream linkage in the industry chain, promoted the agglomeration and development of the integrated circuit industry chain, laid a good foundation for enterprises to improve operational efficiency and reduce comprehensive costs, and will promote the agglomeration, integration, and cluster development of the supply chain of electronic components and integrated circuits in Shenzhen. It will also transform non-standard transactions in areas such as Shenzhen Huaqiangbei into standard transactions, driving the completion of the integrated circuit industry's design, research and development, manufacturing, testing, and other industrial chains. In the future, Shenzhen will collaborate with local distribution companies to move their warehouses from Hong Kong to Shenzhen and jointly establish a giant in the electronic component supply chain industry.
Audience invitation:
Group group visits: China Electronics Information Industry Group, China Electronics International Information Services Co., Ltd., BYD Group, Skyworth Group, Skyworth Research Institute, Konka Group, ZTE Corporation, Huawei Group, China Telecom, TCL Group, Tianma Microelectronics, Zhuhai Gree Electric, Shenzhen Samsung Electronics LG Display、 Shenzhen Great Wall Development, Foxconn Technology Group, Midea Group, Whirlpool, Wanhe, BBK Group, Sanhua Industrial Co., Ltd., etc.
Government and Association Cooperation Audience Organizations: Guangzhou Municipal Bureau of Industry and Information Technology, Chaozhou Municipal Commission of Industry and Information Technology, Zhongshan Municipal Bureau of Industry and Information Technology, Dongguan Electronic Industry Association, Foshan Electronic Information Industry Association, Zhaoqing Electronic Information Industry Association, Zhongshan Electronic Industry Association, Guangzhou Integrated Circuit Industry Association, Chaozhou Electronic Chamber of Commerce, Shunde Electronic Chamber of Commerce, Shunde Electronic Commerce Association, Chaozhou Electronic Motor Industry Association, Shenzhen Electronic Industry Federation, Guangdong Electronic Industry Association, Shenzhen Electronic Chamber of Commerce, Zhongshan Electronic Information Association, Guangzhou Electronic Information Technician Association, etc.
Electronic markets or private organizations: Huaqiang Electronic Market, Bao'an Electronic City, Dongguan Chang'an Minghe Electronic Market, Shenzhen SEG Electronic City, Hualijia Electronic Market, Dongguan SEG Electronic Market.
Estimated scale:
80000+professional audience
100000+square meters of exhibition area
600+exhibitors
30+themes, 100+industry seminars and events
Scope
Scope of Exhibits:
IC products: IC products and technology, IC testing methods and instruments, IC design and design tools, IC manufacturing and packaging;
Semiconductor equipment: semiconductor packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, etc;
Semiconductor materials: monocrystalline silicon, silicon wafer, germanium silicon material, S01 material, gallium oxide material (Ga2O3), diamond, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, etc;
Integrated circuits and applications: microprocessors, third-generation semiconductors FPGA. Power management, analog-to-digital converters, sensors, etc;
Intelligent manufacturing and high-end equipment: electronic production equipment, SMT assembly and systems, instruments and meters, 3D printing, etc;
Optoelectronics: applications of infrared technology, intelligent laser manufacturing, optical communication and intelligent perception, optics, precision optical manufacturing, optoelectronic detection and testing measurement, etc;
Integrated circuit terminal products: artificial intelligence, Internet of Things, smart cities, smart homes, smart terminals, automotive electronics LED、 Intelligent applications such as health and medical care;
IC products: IC products and technology, IC testing methods and instruments, IC design and design tools, IC manufacturing and packaging;
Semiconductor equipment: semiconductor packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, etc;
Semiconductor materials: monocrystalline silicon, silicon wafer, germanium silicon material, S01 material, gallium oxide material (Ga2O3), diamond, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, etc;
Integrated circuits and applications: microprocessors, third-generation semiconductors FPGA. Power management, analog-to-digital converters, sensors, etc;
Intelligent manufacturing and high-end equipment: electronic production equipment, SMT assembly and systems, instruments and meters, 3D printing, etc;
Optoelectronics: applications of infrared technology, intelligent laser manufacturing, optical communication and intelligent perception, optics, precision optical manufacturing, optoelectronic detection and testing measurement, etc;
Integrated circuit terminal products: artificial intelligence, Internet of Things, smart cities, smart homes, smart terminals, automotive electronics LED、 Intelligent applications such as health and medical care;
Costs & Precautions
Please contact the exhibition organizer before participating in the exhibition to confirm.
Contact
- Company:Shanghai Kaixuan Exhibition Service Co., Ltd
- Telephone:86-021-59781615
- Truename:Li Yan
- Mobile:13162209353
- E-mail:2543368807@qq.com
- Address:Exhibition Exhibition Department
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870
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