Nepcon China 2020 the 30th China international electronic production equipment and microelectronics industry exhibition will be opened in Shanghai World Expo exhibition hall on April 22-24, 2020. As an international event of electronic manufacturing industry, it will focus on surface mounting / SMT, welding and dispensing spraying, intelligent factory and automation, test and measurement, electronic new materials and other equipment and technologies. The exhibition will attract more than 500 exhibitors and brands to present innovative solutions to more than 30000 professional buyers from EMS / OEM / ODM, consumer electronics, 5g / communication / smart home / Internet of things, automotive electronics and semiconductor packaging and other hot industries and fields.
Nepcon China 2020 specially launched electronic micro assembly and sip technology exhibition area, electronic micro assembly and sip conference, new energy vehicle three electric system development and test technology conference, smart manufacturing dream factory conference and other innovation exhibition areas and conferences, as well as smart factory and automation technology exhibition at the same time, leading the future trend of smart manufacturing in the electronic industry. By participating in Nepcon China exhibition, industry brand forum and high-end meeting, business recommendation and matching services, and new product tour, the audience can obtain new technology, insight into new product trends and achieve one-stop procurement.
More than 500 brands
35000 square meters of exhibition area
• 30000 professional visitors
• multiple high-quality and high-level technology summits

"SMT surface mount exhibition area" covers SMT, printing, packaging, component supply system, upper and lower board machines, SMT related accessories, etc., gathering domestic and foreign well-known brands and innovative products, and has become the trade platform of the industry.
"Test and measurement exhibition area" is accompanied by the emergence of many new scientific and technological materials and the centralized display of the latest professional test and measurement
"Electronic micro assembly and sip process exhibition area" creates a professional exhibition platform for complete electronic micro assembly, circuit board assembly and finished product assembly through the concept of SMT + packaging (SIP)
"Welding and dispensing spraying exhibition area" Nepcon welding and dispensing spraying exhibition area is your ideal business development platform
"Electronic materials exhibition area" adopts the form of "conference + exhibition area" to provide a business platform for electronic materials enterprises to communicate with end-user groups in R & D and design, Project Manager / Supervisor, technical support, purchase / market / sales, etc
"Smart factory and Automation Technology Exhibition" focuses on the application of "industrial automation" technology and "system integration" scheme in the electronic manufacturing industry

Please contact the organizer of the exhibition for implementation before participation.

• Telephone:021-2231 7000
• Truename:Gu bin Rong
• Fax:021-2231 7181
• E-mail:julia.gu@reedexpo.com.cn
• Address:42nd floor, intercontinental center, 100 Yutong Road, Zhabei District, Shanghai

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