In recent years, the fields of automotive electronics, photovoltaics, wind energy, new energy vehicles, and communication have developed rapidly. Power semiconductors are the core of electrical energy conversion and circuit control in electronic devices, and are one of the basic components of electronic products. In the process of industrial electronic upgrading, they are increasingly valued and applied, and IGBT and SiC power devices are developing rapidly.
With the rapid development of the semiconductor industry, packaging technology continues to advance and innovate. With the increasing demand for electronic packaging technology, ceramic packaging shells LTCC、HTCC、 The rapid development of electronic packaging materials and processes such as metalized ceramic substrates, MLCC、 Electronic components such as filters are developing towards miniaturization, high performance, and high reliability. With the continuous advancement of science and technology, precision ceramic components are widely used in various fields such as semiconductor processes, automobiles, information and communication, industrial machinery, and healthcare.
The 7th Precision Ceramics and Power Semiconductor Industry Chain Exhibition, exclusively hosted by AiBang Zhizao, will be held from August 26-28, 2025 at Hall 7 of Shenzhen International Convention and Exhibition Center (Shenzhen Bao'an New Hall), bringing together upstream and downstream enterprises in the precision ceramics, electronic ceramics, IGBT/SiC power semiconductor and other industries, showcasing the latest technological achievements and product applications in the industry.

fine ceramics
1. Ceramic components and materials: MLCC、LTCC、HTCC、 Barium titanate, barium carbonate, titanium oxide, ceramic ribbon, LTCC dielectric ceramic powder, rare earth oxides, automotive ceramics, etc;
2. Precision ceramics: smart wearable ceramics, structural ceramics, high-temperature ceramics, ceramic microbeads, new energy ceramics, ceramic bearings, etc;
3. Ceramic substrates: DPC, DBC, AMB, HTCC substrates, LTCC substrates, aluminum oxide, aluminum nitride, silicon nitride, beryllium oxide powder and substrates, etc;
4. Metal materials: silver powder, gold powder, copper powder, nickel powder, solder, MLCC internal/external electrode paste, LTCC silver paste, gold paste, tungsten paste, etc;
5. Additives: dispersants, adhesives, plasticizers, coagulants, mineralizers, defoamers, lubricants, etc. for ceramics and conductive slurries;
6. Equipment: sand mill, dry press, grinding machine, slicer, laser equipment, ball mill, spray granulator, tape casting machine, punching machine, hole filling machine, printing machine, laminating machine, laminating machine, isostatic press, glue discharge furnace, sintering furnace, electroplating equipment, network analyzer, appearance inspection, ultrasonic scanning microscope, automation equipment, measuring and wrapping tape machine, injection molding machine, mold, precision engraving machine, silver spraying machine, silver dipping machine, coating equipment, sorting equipment, etc;
7. Consumables: release film, firing plate, firing mesh, foam adhesive, grinding consumables, refractory materials, precision screen, etc.
5G materials and processing
1. 5G new materials: engineering plastics, fluorine materials, resins, glass fibers, flame retardants, hollow glass microspheres, auxiliary fillers; Heat dissipation materials: thermal conductive graphite film, thermal conductive interface material, thermal conductive silicone gel, thermal conductive double-sided tape, thermal conductive grease, graphene, expansion plate, semi-solid die casting, heat pipe/homogenization plate; Shielding materials: conductive cloth, conductive rubber, conductive foam, conductive coating, absorbing material, metal shield, conductive shielding tape.

2. 5G plastic components
5G antenna oscillator: PPS、 Metal PCB、 Fiberglass, additives, injection molding, laser, sandblasting, electroplating, chemical plating, chemicals, cleaning, consumables, etc;
5G antenna cover: ASA、PP、PVC、PC、PEEK、PTFE、PE、 Fiberglass, fiberglass, hollow glass microspheres, additives, extrusion production lines, cone double extruders, extruders, vacuum forming tables, tractors, cutting machines, punching machines, feeding racks, injection molding, compression molding, molds, CNC machining, cutting tools, cleaning, etc;

3. Adhesive
Sealing glue, adhesive sealant, batch coating, thermal conductive material, conductive material, chip packaging glue, optical glue, photoresist, epoxy glue, polyurethane glue, organic silicone gel, UV glue, acrylic pressure-sensitive adhesive, hot melt adhesive, PUR、 Water based adhesives, resins, curing agents, solvents, waxes, monomers, additives, additives, etc;
Brush coating, spray coating, immersion coating, injection, leakage coating, rolling coating, scraping coating supplies, adhesive spot welding equipment; Storage and packaging equipment, cleaning equipment, testing instruments, adhesive tools and techniques, environmental safety equipment, solvent recovery, etc; Adhesive strength testing/measuring/evaluating equipment, strength testing/measuring/evaluating equipment, non-destructive testing equipment, coating testing equipment; Coating equipment, drying equipment, UV curing equipment, cleaning equipment, volatile adhesive purification equipment
4. Consumer electronics
Mobile phone plastic cover: injection molding machine, mold, screw, central feeding system, mold temperature and cold water equipment, robot/robotic arm, air high-pressure molding machine, UV transfer printing, coating machine, automation, precision carving machine, IMT related process equipment PC+PMMA、IML、PC， Hardening materials include UV resin, ink, other consumables, cutting tools, mobile phone covers, hardening production lines, coating processing, full process, and other processing;
Ceramic cover plate: mixing and granulation equipment, screw, injection molding machine, casting machine, sintering furnace, box bowl, CNC machining, polishing and grinding, laser, spraying, coating, testing, powder, sintering agent, feeding, others;
Pen computers: metal structural components, plastic structural components, glass cover plates, carbon fiber materials, engineering plastics, stainless steel/magnesium aluminum alloy/magnesium lithium alloy/aluminum alloy/titanium alloy, leather, thermal conductivity and heat dissipation materials, shielding materials, spraying/IML/nano hot stamping/anodizing/micro arc oxidation, injection molding machines, die-casting/stamping equipment, CNC equipment, testing equipment, automated testing and assembly, etc;
Smart wearables: TWS、 New consumer electronic devices such as smartwatches, smart bracelets, AR/VR glasses, etc;

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:0755-85903000
• Truename:Miss Long
• E-mail:ab036@aibang.com
• Address:808A Pengji Business Space, Bagua 1st Road, Futian District, Shenzhen

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