Chip Exhibition · Shenzhen Chip Exhibition · China Chip Exhibition

China (Shenzhen) International Chip, Module and Application Customization Exhibition 

CHIP-EXPO - Customization and Procurement Platform for Chips, Modules, and Application Solutions

August 26-28, 2025

Shenzhen International Convention and Exhibition Center (Bao'an New Building)

50000 professional visitors and buyers from

Automotive, consumer electronics, smart home, smart terminals, Internet of Things, information and communication, medical, security monitoring

AI, cloud computing, data centers, industrial control, national defense and military, aerospace, etc.

Exhibition Highlights

1. CHIP - China's largest chip and innovative application solution supply and demand docking exhibition platform

2. The exhibition is held in Shenzhen, the largest electronic information industry base in China, with visitors and buyers covering new energy vehicles, consumer electronics, smart home appliances, smart homes, Internet of Things (IoT), communications, security, healthcare, industry, AI artificial intelligence, cloud computing, finance, aerospace, military and other fields;

3. 600+exhibiting companies, 50000+professional visitors and buyers, 40000 ㎡+exhibition area, 20+technical forums

3. Organize multiple supply and demand matchmaking events for chips and their innovative application solutions to help chip suppliers connect with more buyers; Assist purchasers in finding suppliers of higher quality chips and application solutions.

Famous purchaser

Huawei Technologies Co., Ltd. Apple Inc

Tesla (Shanghai) Co., Ltd. BYD Co., Ltd

Xiaomi Technology Co., Ltd. Samsung Electronics Co., Ltd

Geely Automobile Group Co., Ltd. NIO Automobile Co., Ltd

Haier Group Corporation Midea Group Co., Ltd

Ideal Automobile Company Zero Run Automobile Company

OPPO Guangdong Mobile Communication Co., Ltd. ViVO Mobile Communication Co., Ltd

Zhuhai Gree Electric Appliance Co., Ltd. Hisense Group Co., Ltd

HONOR Honor Terminal Co., Ltd. Lenovo Group Co., Ltd

Bosch Home Appliances Group Siemens Home Appliances Group

Dell (China) Co., Ltd., LG Electronics, South Korea

China Hewlett Packard Co., Ltd. Shenzhen Transsion Holdings Co., Ltd

TCL Industrial Holdings Co., Ltd. Konka Group Co., Ltd

ZTE Corporation Shenzhen DJI Innovation Technology Co., Ltd

IFlytek Co., Ltd., Zhuimi Technology (Suzhou) Co., Ltd

Skyworth Group Co., Ltd. Little Bear Electric Co., Ltd

Beijing Stone Century Technology Co., Ltd. Sony Corporation

Galanz Group Co., Ltd. Ecovacs Robotics Co., Ltd

Foxconn Technology Group Lixun Precision Industry Co., Ltd

Electrolux (China) Co., Ltd. Whirlpool (China) Co., Ltd

Yunjing Intelligent Innovation (Shenzhen) Co., Ltd., Aucma Co., Ltd

Xiaoxiong Electric Appliance Co., Ltd. Guangdong Xinbao Electric Appliance Co., Ltd

Exhibition scope

1Various chipsAnd modules：

Processor chip, storage chip, communication chip, Internet of Things (IoT) chip, automotive electronic chip, sensor chip, power management chip, power management chip, logic chip, protection chip, display chip, audio chip, RF chip, multimedia processing chip, voice chip, touch chip, clock chip, LCD driver chip, motor driver chip, charging chip, smart card chip, information recognition chip, face/fingerprint chip, security chip, interface chip, analog chip, mixed signal chip

Time frequency chip, data conversion chip, optical chip, AI artificial intelligence chip, biochip, embedded system chip, customized circuit (ASIC), amplifier chip, operational amplifier chip, special circuit chip, biomedical chip, field programmable gate array (FPGA), programmable logic device (PLD), edge computing chip, other chips, etc;

2Various chip application solutions:

Application solutions for automotive grade chips, consumer electronics, and 3C digital chips

Smart home appliances, smart home chip application solutions, Internet of Things (IoT) chip application solutions

Communication chip application solution Information recognition, facial/fingerprint chip application solution

New Energy Chip Application Solution Computer Chip Application Solution

Security chip application solution Medical electronic chip application solution

Financial Chip Application Solution Security Chip Application Solution

Application solutions for data centers and cloud computing chips Industrial control chip application solutions

National Defense Military Chip Application Solution Satellite and Aerospace Chip Application Solution

AI chip application solutions, other application solutions

• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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