With China's significant investment in technologies such as 5G, AI, IoT, cloud computing, and big data, the "new infrastructure" represented by 5G networks, industrial Internet of Things, and others will drive the high-speed growth of the semiconductor industry. It is predicted that by 2030, the semiconductor market supply in China will reach 538.5 billion US dollars, still the largest in the world. 69% of the consumption will come from local Chinese companies, and the demand will mainly come from application fields such as data centers, consumer electronics, automobiles, and healthcare.
Driven by the support of national policies and downstream market demands such as the Internet of Things, intelligent driving, new energy vehicles, intelligent terminal manufacturing, and new generation mobile communication, the market size of China's semiconductor industry has significantly increased.

The Pearl River Delta is the region with the most solid foundation, complete industrial chain, and advanced technology in China's semiconductor industry.
As a major province in electronic information, Guangdong has inherent advantages in vigorously developing the semiconductor industry. The integrated circuit industry in Guangdong Province is gradually maturing, and third-generation semiconductors have become a highlight. Shenzhen and Guangzhou, as the main cities of the semiconductor industry, along with nine Pearl River Delta cities including Zhuhai, Foshan, Huizhou, Dongguan, Zhongshan, Jiangmen, and Zhaoqing, are making strong efforts to build a semiconductor and integrated circuit industry cluster with international influence. From the perspective of the industrial chain, the Pearl River Delta region is highly concentrated with Huawei, ZTE OPPO、vivo、 A group of globally influential terminal manufacturers such as BYD, CSR, and DJI have provided rich downstream application scenarios for the development of their third-generation semiconductors.

China Semiconductor Industry and Application Expo (IC EXPO), with two wings in Shenzhen and Shanghai, driven by two wheels.
In order to further strengthen exchanges and cooperation in the semiconductor industry, accelerate breakthroughs in key core semiconductor technologies, and effectively promote the coordinated development of the semiconductor industry chain, the organizer of the China Electronics Show, which began in 1964, has launched the China Semiconductor Industry and Application Expo (IC Expo) based on the strong resource advantages of the industry and the successful hosting of the 100th China Electronics Show and the 10th China Electronics Information Expo. The IC Expo is held in Shenzhen in April and Shanghai in November every year, in conjunction with the China Electronics Fair Spring and Autumn Meetings, to facilitate efficient collaboration between industry, academia, and research in the semiconductor industry, and to strengthen, supplement, and extend the semiconductor industry chain in the Pearl River Delta and Yangtze River Delta regions.

Simultaneous activities
Conference Opening Theme Forum
Centered around the theme of "Technology Leading, Innovation Gathers in Shenzhen", relevant government leaders and heavyweight guests attended and delivered speeches, opening the grand opening of the Expo. At the same time, invited industry experts, academicians, industry leading enterprises and other keynote speakers are invited to interpret industry policies, analyze the difficulties and challenges of industry development, and share themes around industry hot topics.

Expo Innovation Award and Gold Award.
The Expo Innovation Award and Gold Award are one of the most representative awards in the field of electronic information, regarded as a barometer of technological innovation achievements in the electronic information industry.

Eight Vertical Field Theme Forums
The latest research results and application cases will be shared and discussed in depth around eight major vertical fields in the semiconductor application field, including intelligent terminals, robots, smart travel, digital life, low altitude economy, data infrastructure, electronic components, and special electronics. This will provide a platform for participants to broaden their horizons, inspire their thinking, and expand cooperation.

N parallel forum events during the same period
More than 50 parallel forum events were held simultaneously, bringing together over 500 heavyweight guests from the global electronic information field, including experts, scholars, and entrepreneurs. The aim was to delve into the latest developments, future trends, hot topics, and key technologies in electronic information, and discuss the development path of the electronic information industry together.

Chip Design/Wafer Manufacturing: Integrated Circuit Design and Chip Manufacturing EDA、MCU、 Wafer manufacturing and equipment and components, etc;

Advanced packaging: Chiplet, SiP packaging, wafer level packaging (WLP), 3D packaging, panel level packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, packaging carriers, IC carriers, semiconductor packaging materials and equipment, etc;

Semiconductor specialized equipment/components: thinning machines, single crystal furnaces, grinding machines, heat treatment equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machines, mounting machines, bonding machines, testing machines, sorting machines, probe stations and components, etc;

Advanced materials/carbon materials/diamond semiconductors: silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc;
Compounds and third-generation semiconductors: nitrides (GaN) and silicon carbide (SiC), zinc oxide (ZnO) diamonds, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc;

Power devices/automotive semiconductors: automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic microassembly and power devices, packaging and testing equipment, automation equipment, etc.

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Truename:Li Na
• E-mail:363064371@qq.com
• QQ:363064371
• Address:2809, 24th Floor, Building A, No. 72 West Third Ring North Road, Haidian District, Beijing

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