The 7th Global Semiconductor Industry (Chongqing) Expo

May 8-10, 2025

Chongqing International Expo Center

Organizational structure

Chongqing Electronic Society

Sichuan Electronic Society

Chongqing Semiconductor Industry Association

Chongqing Power Supply Society

Huaxin Jusha Exhibition (Shanghai) Co., Ltd

Chongqing Fuxiang Exhibition Service Co., Ltd

China Association of Automobile Manufacturers

Chongqing Association for Science and Technology

Chongqing Municipal Commission of Economy and Information Technology

Based on the semiconductor industry in Chongqing, Sichuan, Guizhou, Shaanxi, Hubei, and Yunnan, we showcase new products, cutting-edge technologies, and excellent solutions, providing a professional platform for industry customers to showcase, exchange, and cooperate in the central, western, and southwestern regions.

The industrial advantages of the national strategic Sichuan Chongqing dual city economic circle, the deepening of market development opportunities, the promotion of international interactive platforms for deep exchanges and cooperation in the industrial chain, and the promotion of high-quality innovative development of the semiconductor industry.

As an industry benchmark, the Expo actively seizes the national strategic opportunity of building the "Sichuan Chongqing Dual City Economic Circle", fully demonstrates industrial advantages, and will further enhance Chengdu's position and influence in the core area of electronic industry development in western China, enhance the core competitiveness of Chengdu Chongqing semiconductor industry, and inject new impetus into the development of China's semiconductor industry and electronics.

The authoritative organization empowers with strength, and the Win Win Future Expo is supported by the national authoritative academic organization China Electronics Society, providing opportunities to understand market demand dynamics, industry development trends, new product sharing and release, and expand customer networks.

The exhibition management system will be upgraded and the big data function of the exhibition will be realized by comprehensively presenting the innovative products and technological achievements of the whole industry chain, new technologies and new channels of the Internet. At the same time, it also highlighted the high-quality development achievements and future development directions of the Sichuan Chongqing industry, as well as the innovative trends and market demand of the global semiconductor industry. Multi party linkage integrates high-quality resources and closely cooperates with domestic associations/societies, accurately invites visitors, and the Expo Organizing Committee integrates the advantages of multiple resources. Through zero distance visits to enterprises in Sichuan and Chongqing, professional media promotion, and other methods, it actively boosts confidence and empowers the industry. High end seminar on building industry ecology

Exhibition scope: wafer manufacturing plants, wafer foundries, analog integrated circuits, digital integrated circuits, and mixed signal integrated circuit manufacturing; Industrial Internet platform, intelligent robot, intelligent factory, intelligent automobile networking, smart phone, intelligent transportation, aerospace electronics, smart home appliances, UAV, 5G development and application, multi access edge computing, network slicing, virtual technology, medical electronics, etc; Microwave RF, semiconductor LED, ion power supply, shared smart charging, communication power supply, photovoltaic/photovoltaic/energy storage power supply design, power converter magnetic technology, etc;

Government groups from all over the country, high-tech industrial parks related to semiconductors, securities, banks, insurance, funds, investment and financial institutions, etc. IC Design Zone 1 Integrated Circuit Manufacturing Zone 23 Packaging and Testing Zone Packaging and Testing Whole Factory, Packaging and Testing Process Factory Line Enterprise, Testing Probe Station, Testing Machine, Sorting Machine, Packaging Equipment, Packaging Substrate, Lead Frame Bonding Wire, etc; EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

Silicon wafers and silicon-based materials, photomask templates, high-purity gases, electronic specialty gases, wet electron chemistry, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, fluids, valves, etc;

Thinning machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD, PECVD equipment, coating and developing machine, detection equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station, clean room equipment, etc;

Resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates for printed circuits, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, etc;

• Truename:Liu Wei
• Mobile:15800986159
• E-mail:china3066@126.com
• Address:No. 66 Yuelai Avenue, Yubei District, Chongqing

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