CITE 2025 China (Shenzhen) International Semiconductor Technology and Application Exhibition

Date: April 9-11, 2025 Location: Shenzhen Convention and Exhibition Center

Organizational structure

Guiding units: Ministry of Industry and Information Technology, Shenzhen Municipal People's Government

Hosted by: China Electronics Equipment Co., Ltd., China Electronics Exhibition and Information Communication Co., Ltd., Saite Exhibition (Shenzhen) Co., Ltd

Execution unit: Shanghai Ruimeng Exhibition Service Co., Ltd

Thanks to: Communication Branch of China Electronics Society, China Semiconductor Industry Association, China Electronic Components Industry Association, China Electronic Instrument Industry Association, China Electronic Special Equipment Industry Association, China Electronics Manufacturing Industry Alliance

Market background

The semiconductor sales in the Chinese market account for one-third of the world's total, the largest share, equivalent to the sum of the United States, the European Union, and Japan. However, this is mainly because China is the center of global manufacturing, especially the largest producer of computers and mobile phones, consuming the most chips. With the rapid development of artificial intelligence and the promotion of strategic emerging industries such as 5G, Internet of Things, energy conservation and environmental protection, and new energy vehicles, the demand for semiconductors continues to increase. It is expected that the demand scale of China's semiconductor market will further expand by 2025, and the market demand scale is expected to reach 198.5 billion yuan. In order to better promote communication and interaction in the semiconductor industry and enhance its internationalization level, the "2025 China (Shenzhen) International Semiconductor Technology and Application Exhibition" will be held from April 9-11, 2025 at the Shenzhen Convention and Exhibition Center. The 2025 Shenzhen Exhibition is divided into three major sections: exhibitions, summit forums, and academic conferences. It is an annual event for the semiconductor industry and a comprehensive professional exhibition platform for communication and cooperation between the semiconductor industry and related industries.

The 2025 China (Shenzhen) International Semiconductor Technology and Application Exhibition will showcase the latest products and technologies in the semiconductor industry and applications, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new development trends of the semiconductor market in the future, explore new demands of the future semiconductor market with a development perspective, innovate the content of the exhibition, organize professional visitors from all aspects and levels, and provide the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants.

We look forward to bringing breakthroughs to the overall industry chain through such exhibitions, conferences, and industry linkage. Let product suppliers, equipment providers, product manufacturers, end consumer producers, venture capitalists, and consulting firms participating in the exhibition work together to use the Shenzhen International Semiconductor Industry Exhibition as an effective platform for technical communication and industrial transformation exchange, and engage in exciting interactions.

We sincerely invite you to promote the grand event, share business opportunities, and work together for the future. I hope you can arrange a time to attend at that time. Welcome to participate in this exhibition.

Exhibition scope

1. IC Design and Chip Exhibition Area:

IC and related electronic product design, artificial intelligence chips, power management chips, IoT chips, 5G communication chips and solutions, automotive electronic chips, security control chips, mixed signal communication RF chips, storage chips LED lighting and display driver chips, etc

2. Wafer Manufacturing and Packaging Exhibition Area:

Wafer manufacturing, SiP advanced packaging OSATs、 EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and testing, and packaging testing EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc

3. Semiconductor Equipment Exhibition Area:

Thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, solidification machine, plasma cleaning equipment, cutting machine, mounting machine, bonding machine, wire bonding machine, reflow soldering, wave soldering, testing machine, sorting machine, coupling machine, carrier forming machine, testing equipment, constant temperature and humidity test chamber, sensor, packaging mold, testing fixture, precision slide table, stepper motor, valve, probe table, clean room equipment, water treatment, etc

4. Third Generation Semiconductor Exhibition Area:

Third generation semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED, laser LD, detector UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD. HEMT, etc.), microwave RF devices (HEMT, MMIC), etc

5. Semiconductor Materials Exhibition Area:

Silicon wafers, silicon chips, photoresist, wafer tape, photomask, electronic gas, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc

• Telephone:17612137926
• Truename:Mr.Chen
• Mobile:17612137926
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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