2023 Shenzhen International Electronic Packaging Test Exhibition

Shenzhen International Electronic Packaging Test Exhibition

Essential information

Date: April 09-11, 2023

Venue: Shenzhen Convention and Exhibition Center

Introduction

Today, China has become one of the largest manufacturers of electronic information products in the world. A large number of primary and secondary packaging of many world famous electronic companies are being transferred to China for production. Nowadays, packaging testing and sintering skills have evolved into a pearl in the semiconductor, LED and electronic fields. It is an indispensable process after the completion of integrated circuit chip production and a bridge from devices to systems. Provide a platform for information exchange, market development and business decision-making, Products Show, and technology development for the industry and upstream and downstream industries, and build a bridge for enterprises, institutions, scientific research institutes, and colleges and universities.

With the rapid development of modern electronic information technology, electronic products are developing in the direction of miniaturization, portability and multi-function. Electronic packaging and technology make electronic devices finally become functional products. A variety of new packaging materials, technologies and processes have been developed Electronic packaging is promoting the development of information society together with electronic design and manufacturing. In recent years, the development of packaging has been showing a rapid growth trend. Electronic packaging is used to carry electronic components and their connecting lines, and has good electrical insulation Packaging plays a mechanical support and environmental protection role for chips, and plays an important role in the thermal performance and reliability of devices and circuits. In order to promote the healthy and orderly development of the electronic packaging industry, and build a high-end business platform integrating Products Show, trade procurement, technical exchange and cooperation, "2023 Shenzhen International Electronic Packaging Test Exhibition" will be held in Shenzhen Convention and Exhibition Center from April 9 to 11, 2023. After years of development, It has become an influential event in the electronic packaging industry at home and abroad. We sincerely invite you to participate in this exhibition.

Audience invitation

1. Aerospace, shipbuilding, automobile engineering, instrument and equipment engineering technology, general engineering technology, electronic and electrical industry, IT industry, communication industry, petroleum and coal, energy, metallurgy, household appliances and consumer electronics (mobile phones, wearables, mobile products, VR/AR), automotive electronics, Internet of Things applications, smart homes, smart elderly care, smart cities, Internet of Things applications, high-end equipment, intelligent manufacturing, robots, drones Industrial automation, industrial electronics, rail, transportation, energy, 5G communication, robot machine tools, etc.

2. Scientific research institutes, universities, R&D institutions, industry associations, industrial alliances, industrial parks, high-tech zones, industrial bases, incubators, etc.

Daily schedule

Registration and exhibition arrangement:

April 07-08, 2023 AM8:30-PM19:30

Exhibition time:

April 9, 2023 AM9:30-PM16:45

April 10, 2023 AM9:30-PM16:45

April 11, 2023 AM9:30-PM16:45

Exhibit Range

1、 Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering related products and technologies;

2、 Advanced packaging and system integration: ball grid array packaging, chip level packaging, flip chip, wafer level packaging, 3D integration and other advanced packaging and system integration technologies;

3、 Packaging materials and processes: bonding and wire, solder ball, solder paste, conductive adhesive and other interconnection materials; Underchip fillers, adhesives, film materials, dielectric materials, substrate materials, frame materials, thermal conductivity materials, green electronic materials and other new materials that can achieve high packaging performance and reduce costs; And various packaging and assembly processes;

4、 Packaging design and simulation: various new packaging/assembly designs; Modeling, simulation and verification methods for electrical, thermal, optical and mechanical characteristics of electronic packaging; Multi scale and multi physical quantity modeling;

5、 Packaging in emerging fields: packaging technology for sensors, actuators, MEMS, nano electromechanical systems, micro opto electromechanical systems; Optoelectronic packaging, CMOS image sensor packaging; The application of packaging and integration technology in LCD, passive components, RF, power and high-voltage devices, nano devices and other emerging fields;

6、 High density substrate and assembly technology: embedded passive and active component substrate technology; High density interconnection substrate, printed circuit board, high-density high-performance substrate; And other new substrate technologies that can improve substrate density and performance;

Contact Us

Contact: Mr. Li 150-0190-9485 (same as WeChat)

Consulting QQ: 537402178

• Truename:Mr. li
• Mobile:15001909485
• Address:Intersection of Fuhua Third Road and Jintian Road, Futian District, Shenzhen City, Guangdong Province

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870