Electronic materials are the core of the development of the new generation information technology industry and the strategic, basic and leading industry supporting economic and social development. It is characterized by a wide range of products, high technical threshold, fast updating and strong professionalism, and is widely used in new displays, integrated circuits, solar photovoltaic, electronic circuit boards, electronic components and electronic complete machines, system products and other fields. Its quality and level directly determine the performance of components and complete machines.

In order to further promote the development of the electronic material industry, fully display the cutting-edge equipment technology of the electronic material industry, actively promote the exchange and interaction of the electronic material industry, strengthen the exchange and cooperation awareness of the electronic material industry, and achieve mutual promotion and common development, The "2023 China (Shenzhen) International Electronic Materials Industry Exhibition", which is organized by Shanghai Balang Exhibition Services Co., Ltd., will be held in Shenzhen Convention and Exhibition Center from April 9 to 11, 2023. The theme of the conference is "new materials, new applications, new challenges - collaborative innovation and development", which is consistent with the theme of the conference. Experts at the conference unanimously said that 5G, new display New applications such as high-end components bring new opportunities and challenges to the electronic material industry.

1、 Semiconductor materials:

Polysilicon, monocrystalline silicon, silicon wafer polishing, epitaxial wafers, silicon germanium materials, SOI materials, silicon materials for solar cells and compound semiconductor materials;

2、 Optoelectronic materials:

Laser crystals, materials for LD, raw materials for LED production, materials related to flat panel display (LCD, OLED), optical fiber preforms and related materials, new nonlinear optical materials, etc;

3、 Microelectronic packaging materials:

Epoxy film plastic sealant, lead frame and copper strip, bond alloy wire, epoxy conductive adhesive, solder ball, polyimide resin, BGA/CSP multilayer organic substrate, epoxy primer, etc;

4、 Materials for new electronic components:

Magnetic materials, electronic ceramic materials, piezoelectric crystal materials, green battery materials, information sensing materials, etc;

5、 Base materials and auxiliary materials for PCB:

Copper clad plate, electrolytic copper foil, glass fiber cloth, epoxy resin, FPC materials, etc;

6、 Electronic fine chemical materials:

High purity chemical reagents, electronic special gas, photoresist and accessory products, CMP polishing solution, electronic paste, resist, cleaning agent, etc. for integrated circuits;

7、 Special electronic metal materials:

Precious metal materials, refractory metal materials, electronic tin solder, rare metal materials, etc;

8、 Others:

Manufacturing process, analysis and testing instruments, production, processing and manufacturing equipment, etc;

• Company:Organizing Committee of Shenzhen Electronic Materials Exhibition
• Truename:Mr Zhang
• Mobile:13262858873
• Address:Intersection of Fuhua Third Road and Jintian Road, Futian District, Shenzhen City, Guangdong Province

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